Materials Engineer – Adhesives for Semiconductor Packaging

Lex; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Apple seeks a results‑driven Materials/Chemical Engineer to lead material selection for semiconductor packaging and module assembly, focusing on tape and liquid adhesives for interconnects. You will source and characterize new materials and interpret findings to optimize performance.

The role requires a degree in Materials/Chemical Engineering with 3+ years of experience in DMA/TMA/DSC/Rheometer/TGA and Universal tester characterization, plus knowledge of adhesive materials and characterization

Qualifications

• Degree in Materials/Chemical Engineering.
• 3+ years in DMA/TMA/DSC/Rheometer/TGA and Universal tester characterization.

Responsibilities

• Drive material selection for semiconductor packaging and module assembly, targeting tape and liquid adhesives for mechanical and electrical interconnects.
• Perform new material sourcing and characterization and understand material applications, reporting findings from characterization.

Education

Degree in Materials/Chemical Engineering

Tools

DMA/TMA/DSC/Rheometer/TGA

Universal tester characterization

Job description

Apple seeks a results‑driven Materials/Chemical Engineer to lead material selection for semiconductor packaging and module assembly, focusing on tape and liquid adhesives for interconnects. You will source and characterize new materials and interpret findings to optimize performance.

The role requires a degree in Materials/Chemical Engineering with 3+ years of experience in DMA/TMA/DSC/Rheometer/TGA and Universal tester characterization, plus knowledge of adhesive materials and characterization