Materials Engineer: Adhesives for Semiconductor Packaging

APPLE SOUTH ASIA PTE. LTD.; Singapore; On-site; SGD 60,000 - 120,000; Full time

Job summary

APPLE SOUTH ASIA PTE. LTD. seeks a materials engineer to drive selection and optimization of adhesives and interconnect materials for electrical and optical modules and packaging.

You will perform material sourcing, characterization, and feedback findings during characterization to improve module performance. The role focuses on tape and liquid adhesives for mechanical and electrical interconnects, requiring hands-on characterization using DMA/TMA/DSC/Rheometer/TGA and universal testing

Qualifications

• Degree in Materials or Chemical Engineering.
• 3+ years' experience in DMA/TMA/DSC/Rheometer/TGA and Universal tester characterization.

Responsibilities

• Drive selection and optimization of adhesive and interconnect materials for electrical and optical modules and packaging.
• Develop and implement material characterization strategies for module performance feedback.

Education

Materials/Chemical Engineering

Tools

DMA/TMA/DSC/Rheometer/TGA

Universal tester

Job description

APPLE SOUTH ASIA PTE. LTD. seeks a materials engineer to drive selection and optimization of adhesives and interconnect materials for electrical and optical modules and packaging.

You will perform material sourcing, characterization, and feedback findings during characterization to improve module performance. The role focuses on tape and liquid adhesives for mechanical and electrical interconnects, requiring hands-on characterization using DMA/TMA/DSC/Rheometer/TGA and universal testing