Manager, Process Engineer (Electroplating)

Applied Materials South East Asia Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore APDC team. You will lead development and optimization of next‑generation electroplating processes for advanced semiconductor packaging, managing engineers, driving process innovation, and collaborating with global cross‑functional teams.

The role requires a strong track record in electroplating, copper plating and advanced packaging, plus leadership in R&D process development and product

Qualifications

• Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering or related field.
• 8+ years semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition.
• Strong knowledge of copper plating, wafer‑level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross‑functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.

Responsibilities

• Lead engineers in utilizing techniques to characterize hardware and apply them to hardware characterization across products.
• Plan and execute process engineering projects for the full range of products.
• Interact with key customers to resolve complex process engineering issues across products.
• Develop and implement new technology, products and analytical instrumentation.
• Train and implement new methodologies, define and apply new technologies, troubleshoot and perform root cause analysis.
• Generate documentation and specifications for integrated products and create technical reports.
• Contribute to market share gains through technology improvement.

Skills

Electroplating

Copper plating

Wafer-level packaging

RDL

TSVs

DOE/Stats

Process leadership

Team mentoring

Education

Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering or related field

Job description

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore's Advanced Packaging Development Center (APDC) team. This role will lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications. The successful candidate will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products and technology solutions.

Key Responsibilities

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products
• Manage, develop, plan and execute process engineering projects for entire range of products
• Interact with key customers to resolve significantly complex process engineering issues for entire range of products
• Develop and implement new technology, products and analytical instrumentation
• Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
• Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products
• Contributes to market share gains through technology improvement

Requirements

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition technologies.
• Strong knowledge of copper plating, wafer‑level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross‑functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.

Work Location

• Science Park II (Moving to Tampines office starting Apr 2027)