Lead Electroplating Process Engineer - Semiconductors

Applied Materials South East Asia Pte Ltd; Singapore; On-site; SGD 120,000 - 160,000; Full time

Job summary

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore APDC team. You will lead development and optimization of next‑generation electroplating processes for advanced semiconductor packaging, managing engineers, driving process innovation, and collaborating with global cross‑functional teams.

The role requires a strong track record in electroplating, copper plating and advanced packaging, plus leadership in R&D process development and product

Qualifications

• Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering or related field.
• 8+ years semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition.
• Strong knowledge of copper plating, wafer‑level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross‑functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.

Responsibilities

• Lead engineers in utilizing techniques to characterize hardware and apply them to hardware characterization across products.
• Plan and execute process engineering projects for the full range of products.
• Interact with key customers to resolve complex process engineering issues across products.
• Develop and implement new technology, products and analytical instrumentation.
• Train and implement new methodologies, define and apply new technologies, troubleshoot and perform root cause analysis.
• Generate documentation and specifications for integrated products and create technical reports.
• Contribute to market share gains through technology improvement.

Skills

Electroplating

Copper plating

Wafer-level packaging

RDL

TSVs

DOE/Stats

Process leadership

Team mentoring

Education

Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering or related field

Job description

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore APDC team. You will lead development and optimization of next‑generation electroplating processes for advanced semiconductor packaging, managing engineers, driving process innovation, and collaborating with global cross‑functional teams.

The role requires a strong track record in electroplating, copper plating and advanced packaging, plus leadership in R&D process development and product