Electroplating Process Engineering Lead - R&D Manager

Applied Materials South East Asia Pte Ltd; Singapore; On-site; SGD 180,000 - 300,000; Full time

Job summary

Applied Materials South East Asia Pte Ltd is seeking an R&D Manager, Process Engineering (Electroplating) to lead development and optimization of next‑generation electroplating processes for advanced semiconductor packaging at our Singapore APDC.

You will manage a team of engineers, drive process innovation, and collaborate with global cross‑functional teams to deliver differentiated products and technology solutions. The role is based in Science Park II with a move to Tampines office in 2027.

Qualifications

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.

Responsibilities

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products.

Skills

Semiconductor process engineering

People leadership

DOE

Statistical analysis

Root-cause analysis

Copper plating

Wafer-level packaging

RDL

Copper pillars

TSVs

Advanced packaging

Deposition uniformity

Process optimization

Cross-functional collaboration

Effective communication

Education

PhD in Chemical Engineering

Master's in Materials Science

Bachelor's in Chemistry

Job description

Applied Materials South East Asia Pte Ltd is seeking an R&D Manager, Process Engineering (Electroplating) to lead development and optimization of next‑generation electroplating processes for advanced semiconductor packaging at our Singapore APDC.

You will manage a team of engineers, drive process innovation, and collaborate with global cross‑functional teams to deliver differentiated products and technology solutions. The role is based in Science Park II with a move to Tampines office in 2027.