Lead Principal Engineer, 3D NAND & AI-Driven Memory

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Singapore

On-site

SGD 180,000 - 260,000

Full time

3 days ago
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Job summary

Micron Technology, Inc. in Singapore seeks a senior R&D leader to drive the NAND technology roadmap within the Advanced NAND Technology (ANT) team.

You will work in a cutting-edge environment to translate device concepts, materials, and process integration into manufacturable solutions. You will leverage AI-enabled data analytics and model-driven approaches to tackle scaling challenges, accelerate learning cycles, and influence future memory nodes.

Qualifications

  • Strong foundation in device physics and process integration.
  • Experience in NAND/DRAM memory or related memory tech.
  • Demonstrated ability to design experiments and analyze data.
  • Ability to collaborate across multi-disciplinary R&D teams.
  • Excellent communication and problem-solving skills.
  • Experience with AI or data analytics in research is a plus.

Responsibilities

  • Drive 3D NAND integration and technology roadmap with pathfinding.
  • Lead end-to-end development from concept to validation, including learning vehicles and debugging.
  • Address complex integration challenges using data-driven, AI-assisted approaches.
  • Define and optimize module architectures to meet product requirements.
  • Collaborate across Device, Probe, Test, Design and Operations teams.
  • Foster technical innovation through process improvements and publications.
  • Incorporate AI-assisted tools while ensuring compliance with standards.
  • Promote continuous improvement and share AI-enabled enhancements.

Skills

Device physics
Process integration
NAND/DRAM memory
Experiment design
Data analysis
AI/ML exposure
Cross-functional collaboration

Education

MS or PhD in EE / Materials / Chemical Eng

Job description

Micron Technology, Inc. in Singapore seeks a senior R&D leader to drive the NAND technology roadmap within the Advanced NAND Technology (ANT) team.

You will work in a cutting-edge environment to translate device concepts, materials, and process integration into manufacturable solutions. You will leverage AI-enabled data analytics and model-driven approaches to tackle scaling challenges, accelerate learning cycles, and influence future memory nodes.

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