ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

Micron Technology; Singapore; On-site; SGD 52,000 - 76,000; Full time

Job summary

Micron Technology, Inc. is hiring an Engineer, Package–Silicon Integration to contribute to NAND package and silicon integration for next‑generation memory products. You will learn Micron’s development processes, work with cross‑functional teams, and build foundational skills under guidance.

This entry‑level role offers structured exposure to semiconductor packaging, integration risks, and collaboration within a high‑volume manufacturing environment.

Qualifications

• Bachelor's or Master's degree in Engineering in a related discipline.
• <2 years of relevant semiconductor or manufacturing experience.
• Foundational knowledge of semiconductor packaging and manufacturing processes.
• Ability to follow procedures and learn from feedback.

Responsibilities

• Support CPI assessments with data collection and basic analysis.
• Assist with wafer dicing, scribe design, and assembly topics.
• Participate in DFMEA/PFMEA activities and track actions.
• Collaborate with wafer fab, R&D, and manufacturing on yield and quality investigations.
• Prepare reports and technical documents for design reviews.

Skills

Semiconductor packaging basics

FMEA / DOE exposure

Data analysis

Excel / Word / PowerPoint

Team collaboration

Education

Engineering degree

Tools

Microsoft Excel

Microsoft Word

Microsoft PowerPoint

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Engineer Package–Silicon Integration

As an Engineer, Package–Silicon Integration in Micron’s Package Development Engineering (PDE) organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products.

In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribute to defined engineering tasks, and support execution of package–silicon integration activities. You will operate with close guidance and mentoring, building foundational technical skills while contributing to team objectives.

This position is designed for early‑career engineers and provides structured exposure to semiconductor packaging, integration risks, and cross‑functional collaboration within a high‑volume manufacturing environment.

Key Responsibilities

• Support chip‑package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers.
• Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
• Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
• Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations.
• Support execution of test vehicles and DOEs , including data collection, basic analysis, and report preparation.
• Learn Micron’s package and silicon development flows, design rules, and change‑management processes.
• Prepare technical documentation and presentation materials for design reviews, project updates, and knowledge sharing.
• Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems.

Education & Experience

• Bachelor’s or Master’s degree in Engineering
  (Mechanical, Materials Science, Electrical, Chemical, or related discipline).
• < 2 years of relevant experience , including internships, co‑op programs, or research experience in semiconductor, materials, or manufacturing fields.

Technical & Professional Skills

• Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level).
• Exposure to structured problem‑solving methods (FMEA, DOE, data analysis) through academics or internships.
• Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback.
• Strong attention to detail and willingness to learn new tools, processes, and technologies.
• Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation.
• Good written and verbal communication skills, with the ability to collaborate effectively in a team environment.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.