Hybrid Bonding & Advanced Packaging Process Engineer

Applied Materials, Inc.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Applied Materials, Inc. is seeking a Process Engineer in Singapore to lead development and integration of advanced packaging technologies, focusing on Hybrid Bonding for Logic, Memory, and 3D integration.

You will design and optimize processes, collect data, and collaborate with vendors to deliver high-performance packaging solutions. The role emphasizes DOE-based process characterization, reliability assessment, and close interaction with customers and R&D teams to translate innovative concepts

Qualifications

• Bachelor’s, Master’s or PhD in Engineering, Materials Science, Physics, or related field.
• Minimum 5 years of semiconductor experience in technology development, process integration, or advanced packaging.
• Hands-on experience in Advanced Packaging Hybrid Bonding CMP Plasma Processing Wet Cleaning TSV Integration Process Integration.
• Strong understanding of Hybrid Bonding mechanisms and package integration flows is preferred.
• Experience with DOE, JMP/Minitab, and statistical process analysis.
• Knowledge of reliability, failure analysis, and advanced metrology techniques.

Responsibilities

• Develop and optimize end-to-end Hybrid Bonding processes for logic, memory, and 3D integration.
• Design DOE studies to establish process windows and improve metrics like bond strength and void density.
• Resolve process integration challenges such as CMP topography, contamination, and thermal budget.
• Collaborate with equipment, materials, metrology, and integration teams for scalable solutions.
• Define characterization methodologies using optical, SEM, AFM, XPS, and electrical testing.
• Support development of HBM, Logic, TSV, RDL, and die-to-wafer bonding technologies.
• Engage customers and research partners on joint technology development projects.
• Generate technical reports, patents, publications, and roadmaps.

Skills

Hybrid Bonding

CMP

Plasma Processing

Wet Cleaning

TSV

Process Integration

Education

Bachelor's/Master's/PhD in Engineering, Materials Science, Physics or related

Tools

DOE

JMP/Minitab

Statistical process analysis

Job description

Applied Materials, Inc. is seeking a Process Engineer in Singapore to lead development and integration of advanced packaging technologies, focusing on Hybrid Bonding for Logic, Memory, and 3D integration.

You will design and optimize processes, collect data, and collaborate with vendors to deliver high-performance packaging solutions. The role emphasizes DOE-based process characterization, reliability assessment, and close interaction with customers and R&D teams to translate innovative concepts