Engineer - Test Process (WLCSP)

ASE SINGAPORE PTE. LTD.; Singapore; On-site; SGD 54,000 - 95,000; Full time

Job summary

ASE SINGAPORE PTE. LTD. is seeking an experienced engineer to support and optimize semiconductor manufacturing operations across multiple processes, including Taping, Backgrind, and Laser-based steps.

The role involves leading device introductions, driving recipe qualifications, data collection, and continuous improvement through CIP initiatives. The candidate will troubleshoot process issues, manage machine setups, and ensure strict SOP compliance with 5S and safety guidelines.

Qualifications

• Bachelor’s degree in Engineering or related technical discipline.
• 3+ years of experience in a semiconductor manufacturing environment.
• Hands-on experience with Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools: 8D, FMEA, Control Plans and SPC.

Responsibilities

• Support production operations across Taping, Backgrind, Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate manufacturing hazards and defects.
• Author and maintain SOPs, Work Instructions, and OCAPs.

Skills

Semiconductor experience

Hands-on equipment operation

Quality tools mastery

Education

Bachelor’s degree in Engineering

Tools

8D problem solving

FMEA

Control Plans

SPC

Job description

Responsibilities

• Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output.
• Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization.
• Troubleshoot process issues and manage machine setups to minimize downtime and reduce cycle times.
• Conduct risk assessments to proactively identify and mitigate potential manufacturing hazards and defects.
• Author and maintain critical engineering documentation, including SOPs, Work Instruction Procedures, and Out-of-Control Action Plans (OCAPs).
• Generate technical reports and preserve accurate engineering data for audit readiness.
• Collaborate with cross-functional teams to enforce strict SOP compliance and robust production line controls.
• Drive continuous improvement by executing CIPs focused on quality enhancement, yield optimization, and cost reduction.
• Enforce workplace standards, ensuring strict compliance with company policies, safety protocols, and 5S housekeeping.

Requirements

• Bachelor's Degree in Engineering or a related technical discipline.
• 3+ years of experience within a semiconductor manufacturing environment.
• Hands-on expertise operating Taping, Backgrind, Lasermark, Wafer Mount, Laser Groove, Dicing, and PSI machinery.
• Strong command of core quality tools, including 8D problem-solving, FMEA, Control Plans, and SPC.