Engineer, Process (Backend)

Silicon Box Pte. Ltd.; Singapore; On-site; SGD 67,000 - 112,000; Full time

Job summary

Silicon Box Pte. Ltd. is seeking a Process Engineer in Singapore to develop, establish and optimize backend production processes across Pick and Place, SMT/SMD, Ball Drop, Reflow, Laser Marking, Tape and Reel, Singulation, Packing and AOI.

The role requires hands-on semiconductor backend experience in a cleanroom, with expertise in SPC, FMEA, OCAP and related quality tools, and a focus on defect reduction, cycle time and process capability improvement.

Qualifications

• Bachelor's degree in material science, microelectronics, mechanical engineering or related field.
• At least 3 years of experience in semiconductor manufacturing in a cleanroom environment.
• Hands-on backend process experience in Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.
• Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report.

Responsibilities

• Develop, establish and update production process specifications, workflow, quality and safety docs.
• Manage backend process steps: Pick and Place, SMT/SMD, Ball Drop, Reflow, AOI, etc.
• Troubleshoot process issues and improve yield and cycle time from NPI to production.
• Lead SPC control and maintain process capability.
• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
• Coordinate with vendors on process or quality issues.

Skills

SPC

FMEA

OCAP

Process improvement

Quality auditing

Education

Bachelor's degree in materials science or related field

Tools

CPK

PPK

8D report

WI

Job description

Position Summary

The Process Engineeris responsible fordevelopment and establishment of production process.

Responsibilities

• Responsible forBackend process: Pick and Place/ SMTand SMD/ Ball Drop / Reflow / Laser Marking / Tape and Reel /Singulation /Packing/ AOI, etc.
• Establish, review and update specifications, workflow,qualityand safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities,yieldand cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control.
• Review andmaintainFMEA, Control plan,OCAP with cross-functional teams.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification toestablishprocess baseline.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machinedevelopmentand qualification.
• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line
• Any other ad-hoc duties as assigned by supervisor
  

Requirement

• Minimumbachelor's degree in material science, microelectronics, mechanicalengineeringor relevant engineering field
• At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment
• Hands-on process experience inBackend Process:Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etcwithinsemiconductor IC packaging industry
• Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report