Engineer, Process

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a hands-on engineer to drive wafer-level packaging process improvements across Wet, PVD, Lithography or AOI stages. You will lead SPC, DOE, FEMA, and 8D reporting, and support transitions from pilot to full production.

The role requires cross-functional collaboration, strong problem-solving skills, and a Bachelor’s degree in a relevant engineering field to achieve optimized yield and cycle times.

Qualifications

• Bachelor’s degree in a relevant engineering field.
• 至少 3 years hands-on process experience in Wafer-level Fanout packaging or LCD/FPD production lines.
• Knowledge in process engineering, process control engineering and yield enhancement.

Responsibilities

• Review and accept machine buyoff, set up pilot line process and transfer to production line.
• Establish, review and update specifications, workflow, quality and safety documentation for production line.
• Troubleshoot process issues and improve capabilities, yield and cycle time from NPI to LVM/HVM stages.
• Lead process control measures such as SPC, FDC/KPC and RCA toward zero defects.

Skills

Process engineering

yield enhancement

SPC

FEMA

8D reports

Education

Bachelor’s degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering

Tools

DOE

Job description

Job Description

• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Trouble shoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive process control measures such as SPC, FDC/KPC and RCA towards zero defects.
• Lead and drive continuous improvement activities in area of quality, productivity, cycle time, cost and process control automation.
• Review and update FMEA, Control plan OCAP with cross-functional teams.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Any other ad-hoc duties as assigned.

Requirements:

• Bachelor’s Degree in Chemical, Materials Science, Microelectronics, Mechanical Engineering or relevant engineering degrees.
• At least 3-years hands-on process experience in area of in the Wafer-level Fanout packaging production line or LCD/FPD production line in either Wet, PVD, Lithography or AOI.
• Knowledge in process engineering, process control engineering and yield enhancement.
• Experience in SPC, DOE, FEMA, and 8D reports