Engineer, Product Development Engineering Key Equipment Group (PDE KEG) (Evergreen) (Open)

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. seeks a PDE KEG engineer to identify, evaluate, and qualify new automated equipment and emerging technologies for advanced packaging.

You will install, qualify, and hand over platforms to production, while maintaining EMI and TOR matrices and collaborating with suppliers and cross-functional teams. The role emphasizes integrating AI-enabled tools to improve efficiency, quality, and capability, with travel as required and a strong focus on continuous

Qualifications

• PhD/Masters/Bachelor’s degree in electrical & electronic, materials, mechanical engineering, physics or related field.
• Experience with semiconductor assembly or packaging is a plus.
• 0-2 years in related semiconductor manufacturing.
• Understanding of equipment automation and EMI concepts is desirable.
• Strong written and verbal communication in English.
• Ability to work in cross-functional teams and travel as needed.
• Demonstrated leadership and impact is desirable.
• Willingness to learn and apply AI-enabled tools responsibly.

Responsibilities

• Identify, select, and evaluate new automation equipment to support packaging technology.
• Install and qualify new equipment platforms and handover to production.
• Maintain Equipment Maturity Index (EMI) and Tool of Records (TOR) matrices.
• Collaborate with suppliers and internal teams for upgrades and new capabilities.
• Plan capital requests and define purchasing specifications.
• Enable AI-assisted tools to improve efficiency and quality.
• Provide training and documentation for site representatives.
• Support continuous improvement through data-driven analysis.

Skills

AI integration

Project management

Cross-functional collaboration

Communication skills

Automation & EMI

Technical leadership

Education

Electrical & Electronic Engineering / Materials / Mechanical Engineering / Physics

Job description

As Product Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, and evaluating new equipment (highly automated and computerized) / new technology to support current and future requirement for advantage packaging technology. You will also be responsible for installation and qualification of new equipment platform and handover to production group (Equipment Maturity Index, EMI). In addition, tasks include maintaining a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new equipment platforms, collaborating with production groups on upgrades of existing production equipment through continuous improvement projects

Job Responsibilities:

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Support the evaluation and qualification of new equipment platforms

Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap
Develop and engage creative solutions for new equipment capabilities/ solution to identified constraints or future technology requirements
Work with equipment suppliers to develop new capabilities.
Engage in active participation in Package Development Engineering activities
Conducts equipment benchmarking to establish equipment suppliers and platforms for future need
Assist senior engineers in equipment benchmarking and selection activities

Evaluate and qualify new equipment platform and handover to production group

Plan/submit capital request to acquire new Equipment
Create and owner of purchasing specification (Doc2) document
Establish the new equipment qualification criteria and activities roadmap with respective functional teams
Establish project handover requirements and procedures upon machine qualification
Prepare documentation for handing over with respective site owner
Conduct data gathering for low volume production
Conduct training for Site representatives
Feedback loop for Continuous Improvement after mass volume production via collaborate with production and High-Volume Manufacturing (HVM) team on existing production equipment enhancement through continuous improvement projects

Maintain a matrix of key equipment platform capability and constraints (Equipment Maturity Index, EMI & Tool of Records, TOR) on current and new equipment platform

Driving EMI, a system to standardize equipment maturity expectations, metrics to communicate tool manufacturing readiness, analyzing the requirements to advance tool maturity level
Maintain and regularly update the TOR, with inputs from local or other assembly site
Maintain general knowledge of process and material characteristics and translate to equipment design requirement
Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Equipment System Readiness, Enablement & Enhancement

Conduct equipment characterization, identify and enable the critical equipment parameter monitoring system
Working with Process Control System (PCS), IT & Automation team to enable tool control systems such as FDC (fault detection & classification), E3 (enterprise equipment engineering), APC (advanced process control), tool alarm system, Internet of Thing (IOT), ECM (equipment constant management), R2R (run to run) and other equipment control system whichever applicable
Equipment automation solution enablement for both system datamation (tool- micron host communication) and factory Automated Material Handling System (AMHS) readiness and deployment from equipment perspective follow by working with IT & automation team to deliver full automation solution for production running support

Supplier Management & Engagement Program

Working on several engagement forums from ERM (executive review meeting), TRM (technical review meeting), QBR (quarterly business review) to CIP review to strategize and ensure supplier understand and focus on identified priorities by business value ensuring focus on the greatest benefit
Work with senior engineers and suppliers to support equipment improvement initiatives
Collaborate with supplier on technology and path finding focus, engineering improvement, manufacturing efficiency focus which focus on roadmap development/ solution and H2H partnership with competitive landscape strategies

Job Requirements/ Qualifications:

• PhD/Masters/bachelor’s degree in electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required

• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques

• 0-2 years’ experience in related semiconductor industry or related manufacturing environment

• Experience with technical knowledge on assembly and/or wafer bumping and/or advanced packaging technology is a plus.

• Understanding and/or experience in equipment automation solutions is a plus

• Fast learner, with initiative and independence (min supervision), good team player, ability to integrate and cooperate with cross function teamsand external vendors

• Strong communication (verbal & written) and presentation skills(English speaking is must)

• Understanding business needs and customers’ requirement, able to participate in cross functional team environment

• Strong project management skills to ensure execution to timelines

• Seasonal Travel based on business need will be required

• Performs hardware, software engineering assignments as required

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality or effectiveness.

• Strong analytical, logical, and critical thinking skills

• Growth mindset with a passion for continuous learning

• Internship or experience in the semiconductor industry is a plus

• Demonstrated leadership and a track record of impact are highly desirable

• Interest in and knowledge of the semiconductor industry and Micron is preferred

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

• Inclusion & Accessibility Statement

• Micron is committed to fair, inclusive, and merit based hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates are encouraged to apply.

• Successful candidates are expected to embody Micron’s

Core values:

• People – Respect, develop, and empower others
  Innovation – Drive continuous improvement and breakthrough thinking
  Tenacity – Demonstrate accountability and perseverance
  Collaboration – Build trust and work as one team
  Customer Focus – Deliver excellence and value