Engineer, Product Development Engineering Key Equipment Group (PDE KEG)

Micron Technology; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

Micron Technology in Singapore is looking for a Product Development Engineering Key Equipment Group engineer responsible for evaluating new equipment and technology for advanced packaging. You will collaborate with production groups on upgrades and continuous improvement efforts while ensuring compliance with organizational standards.

This role requires a PhD/Master’s/Bachelor’s degree in a relevant field, with 0-2 years’ experience in the semiconductor industry. Candidates should have strong communication skills and the ability to work independently and on a team.

Qualifications

• 0-2 years’ experience in the semiconductor industry or related manufacturing environment.
• Experience with assembly and/or wafer bumping is a plus.
• Understanding of equipment automation solutions is a plus.

Responsibilities

• Integrate AI-assisted tools to improve efficiency and quality.
• Conduct equipment benchmarking to identify suppliers.
• Maintain a matrix of key equipment platform capability.

Skills

Basic knowledge in semiconductor manufacturing

Strong communication skills

Strong analytical skills

Project management

Education

PhD/Master’s/Bachelor’s degree in relevant field

Job description

As a Product Development Engineering Key Equipment Group (PDE KEG) engineer, you will be primarily responsible for identifying, selecting, and evaluating new equipment (highly automated and computerized) and new technology to support current and future requirements for advantage packaging technology. In addition, you will handle installation and qualification of new equipment platforms and handover to the production group (Equipment Maturity Index, EMI).

Beyond equipment evaluation, you will maintain a matrix of key equipment platform capability and constraints (Tool of Records, TOR) on current and new platforms, collaborating with production groups on upgrades and continuous improvement projects.

Responsibilities

• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within your scope of work.
• Support the evaluation and qualification of new equipment platforms.
• Define, develop and establish new equipment design/capability requirements aligned to the Process and Packaging Roadmap.
• Develop creative solutions for new equipment capabilities or solutions to identified constraints or future technology requirements.
• Work with equipment suppliers to develop new capabilities.
• Engage actively in Package Development Engineering activities.
• Conduct equipment benchmarking to identify suitable suppliers and platforms for future needs.
• Assist senior engineers in equipment benchmarking and selection activities.
• Plan and submit capital requests to acquire new equipment.
• Create and manage purchasing specification documents.
• Establish new equipment qualification criteria and activity roadmaps in collaboration with functional teams.
• Establish handover requirements and procedures upon machine qualification.
• Prepare documentation for handover with the respective site owner.
• Conduct data gathering for low-volume production.
• Conduct training for site representatives.
• Provide feedback for continuous improvement after mass-volume production via collaboration with production and High‑Volume Manufacturing (HVM) teams.
• Collaborate with HVM teams on existing production equipment enhancement projects.
• Drive the Equipment Maturity Index (EMI) to standardise equipment maturity expectations and metrics for communicating tool manufacturing readiness.
• Maintain and regularly update the Tool of Records (TOR) with inputs from local or other assembly sites.
• Translate process and material characteristics into equipment design requirements.
• Continuously search for new equipment or suppliers with improved or new capabilities aligned to Process/Packaging needs.
• Conduct equipment characterization, identify and enable critical equipment parameter monitoring systems.
• Work with Process Control System (PCS), IT & Automation teams to enable tool control systems such as FDC, E3, APC, alarm systems, Internet of Things (IOT), ECM, R2R and other applicable systems.
• Enable equipment automation solutions for both system data management and factory Automated Material Handling System (AMHS) readiness and deployment, delivering full automation support for production running.
• Engage in supplier forums (ERM, TRM, QBR, CIP) to strategise and ensure suppliers focus on identified business‑value priorities.
• Collaborate with senior engineers and suppliers to support equipment improvement initiatives.
• Partner with suppliers on technology, path‑finding focus, engineering improvement, manufacturing efficiency, roadmap development and competitive landscape strategies.

Qualifications

• PhD/Master’s/bachelor’s degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or equivalent work experience.
• Basic knowledge in semiconductor manufacturing assembly, wafer bumping packaging technologies & advanced packaging techniques.
• 0-2 years’ experience in the semiconductor industry or related manufacturing environment.
• Experience with assembly and/or wafer bumping and/or advanced packaging technology is a plus.
• Understanding and/or experience in equipment automation solutions is a plus.
• Fast learner with initiative and independence (minimal supervision), good team player, and ability to integrate and cooperate with cross‑function teams & external vendors.
• Strong communication (verbal & written) and presentation skills; English speaking is a must.
• Understanding business needs and customers’ requirements, able to participate in cross‑functional team environments.
• Strong project management skills to ensure execution to timelines.
• Seasonal travel based on business need will be required.
• Perform hardware, software engineering assignments as required.
• Integrate AI‑assisted tools and insights into daily work to improve efficiency, quality or effectiveness.
• Strong analytical, logical, and critical thinking skills.
• Growth mindset with a passion for continuous learning.
• Internship or experience in the semiconductor industry is a plus.
• Demonstrated leadership and a track record of impact are highly desirable.
• Interest in and knowledge of the semiconductor industry and Micron is preferred.
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Micron is committed to fair, inclusive, and merit‑based hiring. Reasonable accommodation is available to enable individuals with disabilities to perform the essential functions of this role. All qualified candidates will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.