Die Bonding Applications Engineer — Packaging Innovation

CAPCON SINGAPORE PTE. LTD.; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

Capcon Limited Ltd. in Singapore seeks an Application/Process Engineer to join the ACT team.

You will help develop, optimize, and deploy advanced die bonding applications for next-generation semiconductor packaging, working across software and hardware to improve integration and yield. The role requires a strong technical background, hands-on problem solving, and ability to support customers on-site, with cross-functional collaboration across R&D, software, mechanical, electrical, quality, and

Qualifications

• Bachelor's or Master's in Engineering (Mechanical, Electrical, Materials or related).
• 3+ years in semiconductor packaging or die bonding equipment.
• Strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer- or panel-level).
• Experience with equipment integration, motion control, and process development.
• Hands-on troubleshooting in high-tech manufacturing or lab.
• Excellent communication and ability to work cross-functionally.
• Willingness to travel for customer support and on-site installations.

Responsibilities

• Lead design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Troubleshoot die attach tools, process issues, and software anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Skills

Software integration

Hardware integration

Troubleshooting

Cross-functional collaboration

Process optimization

Education

Engineering degree

Job description

Capcon Limited Ltd. in Singapore seeks an Application/Process Engineer to join the ACT team.

You will help develop, optimize, and deploy advanced die bonding applications for next-generation semiconductor packaging, working across software and hardware to improve integration and yield. The role requires a strong technical background, hands-on problem solving, and ability to support customers on-site, with cross-functional collaboration across R&D, software, mechanical, electrical, quality, and