Die Bond Technician: Precision Micro-Bonding Operator

ACCTON TECHNOLOGY SG PTE. LTD.; Singapore; On-site; SGD 28,000 - 42,000; Full time

Job summary

ACCTON TECHNOLOGY SG PTE. LTD. is seeking personnel to operate Die Bond equipment, manage material loading/unloading, and support daily production activities in a cleanroom setting.

The role requires following SOPs, performing first-piece verification and quality inspection, and maintaining accurate production records. Ideal candidates possess a high school diploma, basic computer skills, attention to detail, and strong teamwork abilities.

Qualifications

• High school diploma or above (field not restricted).
• Basic computer skills.
• Detail-oriented, patient and responsible.
• Good learning ability and strong teamwork.
• Able to perform microscope inspections and operate precision equipment.
• Willing to work in a cleanroom environment with ESD compliance and shifts if required.
• Fresh graduates are welcome to apply.

Responsibilities

• Operate Die Bond equipment, load/unload materials and perform production activities.
• Follow SOPs for equipment operation, first-piece verification and quality inspection.
• Maintain production records, perform daily equipment checks and support 5S activities.
• Conduct visual inspections and report any process abnormalities.
• Support production schedules and perform other duties assigned by the supervisor.

Skills

Attention to detail

Teamwork

Learning ability

Fresh graduates welcome

Education

High school diploma

Tools

Die Bond equipment

Precision equipment

Job description

ACCTON TECHNOLOGY SG PTE. LTD. is seeking personnel to operate Die Bond equipment, manage material loading/unloading, and support daily production activities in a cleanroom setting.

The role requires following SOPs, performing first-piece verification and quality inspection, and maintaining accurate production records. Ideal candidates possess a high school diploma, basic computer skills, attention to detail, and strong teamwork abilities.