College Intern - Process and Digitalization

Hewlett Packard Enterprise; Singapore; On-site; SGD 8,900 - 18,000; Full time

Job summary

Hewlett Packard Enterprise Singapore is offering a College Intern position in Process and Digitalization. You will work with the engineering team to develop smart factory solutions using AI, IIoT, and automation in our high-speed manufacturing environment.

Ideal candidates hold a Bachelor's or Master's in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI, and can commit to 5–6 months full-time starting January 2027.

Qualifications

• Pursuing or completed degree in a relevant field such as Mechanical, Manufacturing, Automation, Computer Engineering or Data Science/AI.
• Available for a 5–6 month full-time internship starting Jan 2027.
• Strong communication and teamwork; ability to communicate ideas clearly.

Responsibilities

• Collaborate with engineering to develop smart factory solutions using AI/IIoT and automation.
• Work with high-speed semiconductor packaging tools in a manufacturing setting.
• Participate in concurrent projects on production, sustainability and new product introduction.

Skills

Power BI

Power Automate

Robotic Process Automation

Artificial Intelligence

Machine Learning

Data Analytics

Programming

Teamwork

Communication

Education

Bachelor's degree in Mechanical Engineering

Bachelor's degree in Manufacturing Engineering

Bachelor's degree in Automation Engineering

Bachelor's degree in Computer Engineering

Bachelor's degree in Data Science/Analytics/AI

Master's degree in Mechanical Engineering

Tools

Power BI

Power Automate

Robotic Process Automation (RPA)

Job description

College Intern - Process and Digitalization Description - What a College Intern - Process and Digitalization does at HP: Collaborate with the engineering team to develop solutions in our manufacturing operation using AI, IIOT, Smart vision system and/or other automation solutions. Practical work with on very high speed/high precision die attach equipment, wire bonder, chip attach, high precision over-mold tool and other semiconductor packaging tools in High Volume manufacturing environment. Participates in concurrent projects on current production, sustainability and New Product Introduction. Work alongside an aspiring team of Engineering and Operation executives to build smart factory solutions to future-proof the manufacturing quality of our supplies. Innovates, develops and defines improved manufacturing processes through methodical approach and studies.

Individuals who do well in this role at HP, usually possess: Master or Bachelor's degree in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI or any related field. Able to commit for a 5-6 months full time internship, starting in January 2027. A willingness to learn and the ability to communicate ideas clearly in a team. Strong ability to work as team and as individual. Practical and smart thinking to turn a typical MNC operations into an exciting workplace through implementation of smart technology. Applied Skill with Power BI, Power Automate and/or Robotic Process Automation would be an advantage. Good knowledge and applied skills in AI, IIOT, digitalization, Machine Learning and/or software programming skills would be an added advantage.

Sustainable impact is HP's commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision - to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner - we commit to human capital development and adopting progressive workplace practices in Singapore.

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