College Intern - Process and Digitalization

HP; Singapore; On-site; SGD 20,000 - 27,000; Full time

Job summary

HP is offering a College Intern - Process and Digitalization in Singapore to work with the engineering team on cutting-edge manufacturing automation. The role involves hands-on work with advanced equipment and smart factory initiatives to enhance production quality and sustainability.

Ideal candidates hold a relevant degree and are ready to commit 5–6 months full-time starting January 2027, with a strong willingness to learn, teamwork, and problem-solving abilities.

Qualifications

• Bachelor’s or Master’s degree in a related field.
• 5–6 months full-time internship starting January 2027.
• Willingness to learn and communicate ideas clearly in a team.
• Ability to work both in a team and independently.
• Practical mindset to apply smart technology in manufacturing operations.
• Experience with Power BI/Power Automate and/or RPA is a plus.
• Knowledge of AI/IIoT/digitalization/ML or programming is advantageous.

Responsibilities

• Collaborate with engineering to develop solutions using AI, IIoT, or other automation.
• Work with high-speed die attach and semiconductor packaging tools in a high-volume environment.
• Participate in concurrent projects related to production, sustainability, and NPI.
• Help build smart factory solutions to enhance manufacturing quality.
• Develop and define improved manufacturing processes through methodical studies.

Skills

AI

Machine Learning

IIoT

Digitalization

Software programming

Education

Bachelor’s degree in Mechanical/Manufacturing/Automation/Computer Engineering/Data Science/Analytics/AI

Tools

Power BI

Power Automate

Robotic Process Automation

Job description

College Intern - Process and Digitalization

Description -

What a College Intern - Process and Digitalization does at HP:

• Collaborate with the engineering team to develop solutions in our manufacturing operation using AI, IIOT, Smart vision system and/or other automation solutions.
• Practical work with on very high speed/high precision die attach equipment, wire bonder, chip attach, high precision over-mold tool and other semiconductor packaging tools in High Volume manufacturing environment.
• Participates in concurrent projects on current production, sustainability and New Product Introduction.
• Work alongside an aspiring team of Engineering and Operation executives to build smart factory solutions to future-proof the manufacturing quality of our supplies.
• Innovates, develops and defines improved manufacturing processes through methodical approach and studies.

Individuals who do well in this role at HP, usually possess:

• Master or Bachelor’s degree in Mechanical, Manufacturing, Automation, Computer Engineering, Data Science/Analytics/AI or any related field.
• Able to commit for a 5-6 months full time internship, starting in January 2027.
• A willingness to learn and the ability to communicate ideas clearly in a team.
• Strong ability to work as team and as individual.
• Practical and smart thinking to turn a typical MNC operations into an exciting workplace through implementation of smart technology.
• Applied Skill with Power BI, Power Automate and/or Robotic Process Automation would be an advantage.
• Good knowledge and applied skills in AI, IIOT, digitalization, Machine Learning and/or software programming skills would be an added advantage.

Sustainable impact is HP's commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision - to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner - we commit to human capital development and adopting progressive workplace practices in Singapore.

#Li-Post

Job -

Administration

Schedule -

Full time

Shift -

No shift premium (Singapore)

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"