Chief Semiconductor Packaging Architecture & Simulation

MRL Consulting Group | Global Niche Technology Recruitment; Singapore; On-site; SGD 180,000 - 280,000; Full time

Job summary

MRL Consulting Group | Global Niche Technology Recruitment is seeking a high-impact Head of Advanced Semiconductor Packaging Design & Simulation to lead architecture, design, and validation of next-generation packaging solutions. You will own multiphysics simulation, prototype validation, and collaboration across silicon, board, thermal, and manufacturing teams.

You will drive technical strategy, establish standards, and mentor a team of packaging engineers to deliver reliable, scalable

Qualifications

• Bachelor’s degree or higher in Electrical Engineering, Microelectronics, Materials Science, Mechanical Engineering or related.
• 10+ years of relevant experience in semiconductor packaging design, development or engineering.
• Demonstrable ownership of complex semiconductor packaging programmes from architecture to volume production.
• Strong understanding of advanced packaging technologies (flip-chip, FC-BGA) and interconnects.

Responsibilities

• Define advanced packaging architectures, roadmaps and design strategies for current and future products.
• Lead design decisions on package structures, die placement, substrate stack-ups and interconnect technologies.
• Oversee design feasibility, manufacturability, yield, cost and supply-chain considerations throughout development.
• Lead chip, package and board co-design activities including routing and manufacturing constraints.
• Drive design reviews, issue resolution and sign-off for production.
• Lead SI/PI/thermal analyses across complex packaging designs and establish simulation methodologies.

Skills

Semiconductor packaging

Team leadership

Multidisciplinary engineering

Simulation expertise

Architecture strategy

English fluency

Education

Bachelor’s degree+ in Electrical Engineering or related

Tools

EDA tools

Simulation software

Job description

MRL Consulting Group | Global Niche Technology Recruitment is seeking a high-impact Head of Advanced Semiconductor Packaging Design & Simulation to lead architecture, design, and validation of next-generation packaging solutions. You will own multiphysics simulation, prototype validation, and collaboration across silicon, board, thermal, and manufacturing teams.

You will drive technical strategy, establish standards, and mentor a team of packaging engineers to deliver reliable, scalable