MNC Semiconductor | Equipment Engineer (Wire Bond)

Wanco Manpower Pte Ltd; Singapore; On-site; SGD 48,000 - 66,000; Full time

Job summary

Wanco Manpower Pte Ltd on behalf of our client, a leading global semiconductor manufacturer, is seeking an Associate Engineer to support Wire Bond equipment maintenance in the North Region. The role requires hands-on experience and a proactive approach to reliability.

You will perform setup, qualification, and routine maintenance, troubleshoot issues, and assist production during breakdowns. 12-hour rotating day/night shifts are required, and a diploma in a related engineering discipline is

Qualifications

• Diploma in Electrical, Electronics, Mechanical or Mechatronics.
• At least 2 years hands-on Wire Bond equipment maintenance experience.
• Experience with KNS Maxum, iConn, or Rapid Bonder preferred.
• Strong troubleshooting and problem-solving skills.
• Knowledge of semiconductor backend assembly is a plus.
• Willing to work 12-hour rotating shifts Day/Night.

Responsibilities

• Set up, qualify, and convert Wire Bond machines.
• Troubleshoot and repair equipment to minimize downtime.
• Perform preventive and corrective maintenance for reliability.
• Monitor equipment performance and drive improvements.
• Support production during breakdowns and urgent issues.
• Perform root cause analysis and document actions.

Skills

Wire Bond Equipment

Troubleshooting

Preventive Maintenance

Root Cause Analysis

Shift Work

Education

Diploma in Electrical Engineering

Diploma in Electronics Engineering

Diploma in Mechanical Engineering

Diploma in Mechatronics Engineering

Tools

KNS Maxum

iConn

Rapid Bonder

Job description

Our client is a leading global semiconductor manufacturing company specializing in advanced semiconductor technologies. They are expanding their operations and are looking for motivated individuals to join their growing team.

Position: Associate Engineer – Wire Bond Equipment
Location: North Region
Working Hours: 12-hour rotating shift (Day & Night Shift)
Employment Type: Permanent Role

Job Responsibilities

• Perform equipment setup, qualification, and conversion for Wire Bond machines.

• Troubleshoot and repair equipment-related issues to minimize production downtime.

• Conduct preventive and corrective maintenance to ensure equipment reliability.

• Monitor equipment performance and implement improvement actions.

• Support production during machine breakdowns and urgent technical issues.

• Perform root cause analysis, implement corrective actions, and maintain equipment and spare parts records.

Job Requirements

• Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering, or related discipline.

• Minimum 2 years of hands-on experience in Wire Bond equipment maintenance and troubleshooting.

• Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.

• Strong equipment troubleshooting, maintenance, and problem-solving skills.

• Knowledge of semiconductor backend assembly processes is an advantage.

• Willing to work 12-hour rotating shifts, including day and night shifts.