MNC Semiconductor - Equipment Engineer (Wire Bond)

WANCO MANPOWER PTE LTD; Singapore; On-site; SGD 42,000 - 62,000; Full time

Job summary

Wanco Manpower Pte Ltd is assisting a client in Singapore to recruit an Associate Engineer for Wire Bond equipment maintenance. The role requires hands-on experience with wire bond machinery, strong troubleshooting skills, and willingness to work 12-hour rotating day and night shifts in the North Region.

Qualifications include a Diploma in Electrical/Electronics/Mechanical/Mechatronics and 2+ years of relevant experience; familiarity with KNS Maxum, iConn, or Rapid Bonder is preferred.

Qualifications

• Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related discipline.
• Minimum 2 years of hands-on experience in Wire Bond equipment maintenance and troubleshooting.
• Experience with KNS Maxum, iConn, or Rapid Bonder machines preferred.
• Strong equipment troubleshooting, maintenance and problem-solving skills.
• Knowledge of semiconductor backend assembly processes is an advantage.
• Willing to work 12-hour rotating shifts, including day and night shifts.

Responsibilities

• Perform equipment setup, qualification, and conversion for Wire Bond machines.
• Troubleshoot and repair equipment-related issues to minimize production downtime.
• Conduct preventive and corrective maintenance to ensure equipment reliability.
• Monitor equipment performance and implement improvement actions.
• Support production during machine breakdowns and urgent technical issues.
• Perform root cause analysis, implement corrective actions, and maintain equipment and spare parts records.

Skills

Troubleshooting

Maintenance planning

Problem solving

Education

Diploma in Electrical/Electronics/Mechanical/Mechatronics Engineering

Tools

KNS Maxum

iConn

Rapid Bonder

Job description

Our client is a leading global semiconductor manufacturing company specializing in advanced semiconductor technologies. They are expanding their operations and are looking for motivated individuals to join their growing team.

Position: Associate Engineer - Wire Bond Equipment

Location: North Region

Working Hours: 12-hour rotating shift (Day & Night Shift)

Employment Type: Permanent Role

Job Responsibilities

• Perform equipment setup, qualification, and conversion for Wire Bond machines.
• Troubleshoot and repair equipment-related issues to minimize production downtime.
• Conduct preventive and corrective maintenance to ensure equipment reliability.
• Monitor equipment performance and implement improvement actions.
• Support production during machine breakdowns and urgent technical issues.
• Perform root cause analysis, implement corrective actions, and maintain equipment and spare parts records.

Job Requirements

• Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering, or related discipline.
• Minimum 2 years of hands-on experience in Wire Bond equipment maintenance and troubleshooting.
• Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.
• Strong equipment troubleshooting, maintenance, and problem-solving skills.
• Knowledge of semiconductor backend assembly processes is an advantage.
• Willing to work 12-hour rotating shifts, including day and night shifts .