AI-Driven Packaging Materials Engineer

Micron Technology, Inc.; Singapore; On-site; SGD 55,000 - 85,000; Full time

Job summary

Micron Technology, Inc. is seeking a Material Engineer to drive packaging material qualification, improvements, and supplier quality to support cost, quality, delivery, and risk objectives.

You will collaborate with KMG teams, manufacturing sites, and suppliers to qualify materials, manage changes, and ensure lab readiness. The role includes performing qualification testing (ESD, dimensions, drop, leak), applying 8D/SPC/JMP tools for root-cause analysis, and maintaining 6S in the lab while

Qualifications

• Master’s or Bachelor’s degree in engineering or related field.
• 0–2 years of material qualification or packaging materials experience is a plus.
• Knowledge of quality and statistical analysis tools.
• Ability to work independently while supporting global teams.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator across all levels.

Responsibilities

• Integrate AI-assisted tools into daily work to improve efficiency.
• Collaborate with KMG teams and sites to implement material improvements.
• Plan and perform qualification testing (ESD, dimensional, drop, leak).
• Maintain 6S standards and material laboratory assets.
• Manage supplier quality activities and corrective actions with SQN and GDMS.
• Conduct material qualification for packaging materials and components.

Skills

Analytical thinking

Effective communicator

Collaboration

Growth mindset

Leadership

Education

Master’s / Bachelor’s degree in Engineering or related technical discipline

Tools

8D

SPC

JMP

Job description

Micron Technology, Inc. is seeking a Material Engineer to drive packaging material qualification, improvements, and supplier quality to support cost, quality, delivery, and risk objectives.

You will collaborate with KMG teams, manufacturing sites, and suppliers to qualify materials, manage changes, and ensure lab readiness. The role includes performing qualification testing (ESD, dimensions, drop, leak), applying 8D/SPC/JMP tools for root-cause analysis, and maintaining 6S in the lab while