Advanced Packaging R&D Engineer Intern

Applied Materials, Inc.; Singapore; Presencial; SGD 16 000 - 27 000; Tempo integral

Resumo da oferta

Applied Materials, Inc. in Singapore offers a full-time internship in advanced packaging, focusing on redistribution layers, damascene copper, and wafer-level interconnects.

You will support the Process Integration team with test vehicle development, experimental design, and data analysis to enable chip-to-wafer and wafer-to-wafer bonding. Throughout the internship you will gain hands-on exposure to semiconductor fabrication processes and engineering problem-solving methodologies, developing a

Qualificações

• Currently enrolled in a relevant engineering or science program
• Experience with data analysis and experimental design is beneficial
• Hands-on exposure to semiconductor packaging preferred

Responsabilidades

• Develop process flows and experimental designs
• Analyze data and characterize defects
• Correlate process parameters with electrical and physical performance
• Gain hands-on exposure to semiconductor fabrication and packaging

Conhecimentos

Data analysis

Engineering problem-solving

Statistical methods

Experiment design

Descrição da oferta de emprego

Applied Materials, Inc. in Singapore offers a full-time internship in advanced packaging, focusing on redistribution layers, damascene copper, and wafer-level interconnects.

You will support the Process Integration team with test vehicle development, experimental design, and data analysis to enable chip-to-wafer and wafer-to-wafer bonding. Throughout the internship you will gain hands-on exposure to semiconductor fabrication processes and engineering problem-solving methodologies, developing a