Semiconductor Advanced Packaging Mechanical Design Engineer ( TCB / Flip-Chip ) - YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

The Supreme Hr Advisory Pte. Ltd. is seeking a Mechanical Design Engineer / Senior Mechanical Design Engineer in Singapore.

The role focuses on designing mechanical systems for semiconductor packaging equipment, developing 3D models, drawings, BOMs, and technical documentation to support wafer handling and precision motion modules. You will collaborate with multiple teams to ensure accuracy, reliability, and manufacturability, while supporting assembly, testing, and customer qualification

Qualifications

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Automation, or related discipline.
• 2+ years of mechanical design experience in semiconductor equipment or related fields.
• Proficiency in 3D CAD software (Creo, SolidWorks, Inventor, CATIA, NX) and ability to prepare detailed drawings.
• Knowledge of fits and tolerances, GD&T, bearings and linear-motion components, machining and fabrication.

Responsibilities

• Design mechanical systems and modules for semiconductor packaging equipment.
• Develop 3D models, drawings, BOMs, and documentation.
• Design wafer handling and motion components including precision stages, bondheads, and thermal structures.
• Perform tolerance stack-up, design reviews, and ensure accuracy, stiffness, and vibration control.
• Collaborate with process, electrical, software, and manufacturing teams.
• Support assembly, testing, troubleshooting, and customer qualification.
• Improve existing modules for accuracy, reliability, and cost.

Skills

Mechanical design

3D CAD

Tolerance analysis

Finite element/thermal analysis

Precision motion systems

Prototype development

Education

Diploma in Mechanical Engineering

Bachelor’s degree in Mechanical/Mechatronics/Automation

Tools

Creo

SolidWorks

Inventor

CATIA

NX

Job description

Position title : Mechanical Design Engineer / Senior Mechanical Design Engineer

Location: Admirax St
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary :SGD 6,000 – SGD 9,000/month (Based on experience and technical capability)

Responsibilities:

• Design mechanical systems and modules for TCB, flip-chip, die-bonding, and advanced semiconductor packaging equipment.
• Develop mechanical concepts, 3D models, detailed drawings, assembly drawings, BOMs, and technical documentation.
• Design equipment modules such as:
• - Wafer handling systems
• - Substrate, strip, panel, or glass-panel handling systems
• - Die ejection, die pickup, and die transfer mechanisms
• - Precision XY, XYZ, XYZT, and multi-axis positioning stages
• - Bondheads and thermal bondheads
• - Micro-Z, force-control, compliance, and tip-tilt mechanisms
• - Heating, cooling, vacuum, gas, and thermal isolation structures
• - Conversion kits, change parts, fixtures, tooling, nests, and bond tools
• Select suitable mechanical and motion components, including bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, and flexures.
• Conduct tolerance stack-up and design reviews for critical precision assemblies.
• Consider positioning accuracy, repeatability, structural stiffness, vibration, thermal expansion, force transmission, alignment, and serviceability in the design.
• Work closely with process, electrical, software, vision, motion-control, manufacturing, procurement, and service teams.
• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
• Investigate machine problems and implement practical design improvements.
• Improve existing modules for better accuracy, reliability, cycle time, manufacturability, and cost.
• Maintain proper engineering documentation and design-change records.

Requirements:

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation, or a related discipline.
• Approximately2 or more years of mechanical design experiencein semiconductor equipment, precision automation, machine building, motion systems, or related industries.
• Proficiency in 3D mechanical CAD software such as Creo, SolidWorks, Inventor, CATIA, NX, or equivalent.
• Able to prepare detailed manufacturing and assembly drawings.
• Good understanding of:
• - Fits and tolerances
• - GD&T
• - Bearings and linear-motion components
• - Machining and fabrication processes
• - Material selection and surface treatment
• - Mechanical assembly and alignment
• Able to develop practical mechanism concepts rather than only produce drawings from instructions.
• Willing to support machine assembly, debugging, testing, and continuous improvement.
• Experience in semiconductor packaging or semiconductor automation equipment.
• Experience designing precision, high-stiffness, or thermally stable machine modules.
• Knowledge of thermal expansion, heater integration, thermal isolation, and temperature uniformity.
• Experience with precision motion, force control, vacuum systems, pneumatics, or cleanroom-compatible equipment.
• Experience with tolerance analysis, FEA, thermal simulation, or structural analysis.
• Experience taking a module from concept through assembly, testing, and customer acceptance.
• Familiarity with DFM, DFA, cost reduction, and engineering change control.
• Experience with prototype, customised, or first-of-a-kind equipment development.