3D NAND Yield & Process Integration Engineer

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a NAND Module Process Integration Engineer to design, develop, and implement innovative solutions to improve next-generation 3D NAND product yield and quality within required timelines.

The role involves leading cross-functional teams, refining CSPEC criteria for optimal performance, coordinating manufacturing site activities, and establishing proofs of concept for future tech nodes. Strong data analysis and collaboration skills are essential.

Qualifications

• Must have passion for semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.

Responsibilities

• Identify key module deficiencies and technology gaps.
• Lead cross-functional teams to address issues.
• Improve current process flows and develop solutions meeting product requirements and manufacturability.
• Coordinate activities to secure funding for experiments and communications with R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate new integration schemes for alpha/derivative parts.
• Assist in transfer of new technology from R&D to manufacturing.

Skills

Semiconductor tech

Data analysis

Cross-functional teams

Education

BS/MS in Microelectronics

Job description

Micron Technology, Inc. in Singapore is seeking a NAND Module Process Integration Engineer to design, develop, and implement innovative solutions to improve next-generation 3D NAND product yield and quality within required timelines.

The role involves leading cross-functional teams, refining CSPEC criteria for optimal performance, coordinating manufacturing site activities, and establishing proofs of concept for future tech nodes. Strong data analysis and collaboration skills are essential.