3D NAND Process Integration Engineer - Yield & Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a NAND Module Process Integration Engineer in Singapore to design and implement innovative process solutions that improve 3D NAND product yield and quality within schedule and cost constraints.

You will lead cross-functional teams, define performance criteria, evaluate new integration schemes, and support technology transfer from R&D to manufacturing while embedding AI-enabled improvements across the workstream.

Qualifications

• Must have at least 2 years in semiconductor industry.
• Experience with data analysis, visualization or simulation tools (JMP, Tableau) is desirable.
• Strong understanding of PI modules and NAND technology.
• Experience across RD to manufacturing life cycle is desirable.

Responsibilities

• Identify and quantify module deficiencies; lead cross-functional teams to address issues.
• Develop CSPEC criteria for product performance and drive process capability.
• Coordinate site activities to secure funding for experiments and conversions.
• Lead development projects for new integration schemes and proof concepts for future tech nodes.
• Lead quarterly yield summits and monthly reviews to align R&D, Manufacturing and leadership.
• Support transfer of new technology from R&D to manufacturing and ensure ramp-up.
• Integrate AI-assisted tools to improve efficiency, quality, or effectiveness.
• Promote continuous improvement by sharing AI-enabled enhancements.

Skills

Data analysis

Cross-functional collaboration

Process integration optimization

NAND memory knowledge

Communication skills

Education

BS/MS/PhD in Materials Science / Electrical Engineering / Microelectronics / Chemical Physics

Tools

JMP

Tableau

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. seeks a NAND Module Process Integration Engineer in Singapore to design and implement innovative process solutions that improve 3D NAND product yield and quality within schedule and cost constraints.

You will lead cross-functional teams, define performance criteria, evaluate new integration schemes, and support technology transfer from R&D to manufacturing while embedding AI-enabled improvements across the workstream.