NAND Process Integration Engineer — Drive 3D NAND Tech

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineer for NAND Process Integration to design, develop, and implement innovative PI solutions for next‑gen 3D NAND with focus on yield, quality, and cost targets.

You will own modules, set specifications, and lead cross‑functional teams to drive robust production readiness. The role requires strong data analysis, problem‑solving, and collaboration skills, with experience in R&D, technology transfer, and familiarity with NAND processes.

Qualifications

• Education in Electrical Engineering, Microelectronics, Chemical Engineering, or Materials Science.
• Experience with R&D and technology transfer in semiconductors is preferred.
• Ability to script or program; BI tools desirable.

Responsibilities

• Lead one or more PI process modules in 3D NAND tech.
• Define structural specifications and process requirements.
• Drive continual improvement and strategic module direction.
• Design experiments to develop and integrate processes.
• Coordinate cross-functional teams and communicate progress.

Skills

Data analysis

Problem-solving

Process optimization

Communication

Team collaboration

Education

Bachelor's/Master's/PhD in Electrical Engineering or related

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Micron Technology, Inc. in Singapore is seeking an Engineer for NAND Process Integration to design, develop, and implement innovative PI solutions for next‑gen 3D NAND with focus on yield, quality, and cost targets.

You will own modules, set specifications, and lead cross‑functional teams to drive robust production readiness. The role requires strong data analysis, problem‑solving, and collaboration skills, with experience in R&D, technology transfer, and familiarity with NAND processes.