Senior Semiconductor Packaging Innovator

PH62 Nexperia Philippines

Laguna

On-site

PHP 1,200,000 - 1,800,000

Full time

14 days+

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Benefits offered by this job

Competitive salary

Professional development opportunities

Commitment to safety and well-being

Dynamic work environment

Job summary

Nexperia Philippines is seeking a Package Architect to drive development, qualification, and implementation of new semiconductor package technologies and materials. You will collaborate with internal sites, subcontractors, and cross-functional teams to deliver robust packaging solutions.

The role requires a Bachelor's in engineering, strong knowledge of semiconductor assembly, and hands-on quality methodologies.

Qualifications

Bachelor's degree in engineering (electronics, mechanical, materials, manufacturing) or related discipline.
Strong knowledge of semiconductor packaging and assembly processes.
Hands-on with engineering and quality methodologies (SPC, DOE, MSA/GRR, 8D, DFMEA/PFMEA, Control Plans).
Experience with statistical analysis software (JMP, Minitab, Statistica).
Experience with subcontractors in semiconductor manufacturing preferred.

Responsibilities

Develop, qualify, and introduce new semiconductor package technologies, processes, and materials for Power Package applications.
Collaborate with internal sites, subcontractors, cross-functional teams, and business groups to deliver new package solutions.
Evaluate and select subcontractors through technical assessments and RFQs.
Conduct package and process integration risk assessments.
Review DOE and engineering evaluations to ensure robust product development.
Monitor qualification plans and process validations through reviews and Gemba.
Drive failure analysis investigations and implement corrective actions.
Prepare and present technical reports and documents.
Submit invention disclosures and patent applications.
Maintain stakeholder communication to align objectives.
Benchmark subcontractor and internal site capabilities; develop technology roadmaps.
Support project execution to meet KPIs and IP generation.
Travel within Asia and occasionally to Europe for development and collaboration.