Senior Package Architect

PH62 Nexperia Philippines; Laguna; On-site; PHP 1,200,000 - 1,800,000; Full time

Benefits offered by this job

Competitive salary

Professional development opportunities

Commitment to safety and well-being

Dynamic work environment

Job summary

Nexperia Philippines is seeking a Package Architect to drive development, qualification, and implementation of new semiconductor package technologies and materials. You will collaborate with internal sites, subcontractors, and cross-functional teams to deliver robust packaging solutions.

The role requires a Bachelor's in engineering, strong knowledge of semiconductor assembly, and hands-on quality methodologies.

Qualifications

• Bachelor's degree in engineering (electronics, mechanical, materials, manufacturing) or related discipline.
• Strong knowledge of semiconductor packaging and assembly processes.
• Hands-on with engineering and quality methodologies (SPC, DOE, MSA/GRR, 8D, DFMEA/PFMEA, Control Plans).
• Experience with statistical analysis software (JMP, Minitab, Statistica).
• Experience with subcontractors in semiconductor manufacturing preferred.

Responsibilities

• Develop, qualify, and introduce new semiconductor package technologies, processes, and materials for Power Package applications.
• Collaborate with internal sites, subcontractors, cross-functional teams, and business groups to deliver new package solutions.
• Evaluate and select subcontractors through technical assessments and RFQs.
• Conduct package and process integration risk assessments.
• Review DOE and engineering evaluations to ensure robust product development.
• Monitor qualification plans and process validations through reviews and Gemba.
• Drive failure analysis investigations and implement corrective actions.
• Prepare and present technical reports and documents.
• Submit invention disclosures and patent applications.
• Maintain stakeholder communication to align objectives.
• Benchmark subcontractor and internal site capabilities; develop technology roadmaps.
• Support project execution to meet KPIs and IP generation.
• Travel within Asia and occasionally to Europe for development and collaboration.

Skills

Analytical skills

Communication & presentation

Leadership & cross-functional

Quality methodologies (SPC/DOE/MSA/8D/

Statistical software (JMP/Minitab/Stat

Education

Bachelor's degree in engineering (electronics/mechanical/materials/manufacturing)

Tools

JMP

Minitab

Statistica

Job description

About the Role

We are looking for a Package Architect to drive the development, qualification, and implementation of new semiconductor package technologies, processes, and materials that support Nexperia's business strategy. In this role, you will collaborate with internal manufacturing sites, subcontractors, cross-functional teams, and business groups to deliver innovative packaging solutions while ensuring robust package and process integration.

What You Will Do

• Develop, qualify, and introduce new semiconductor package technologies, processes, and materials for Power Package applications.

• Collaborate with internal sites, subcontractors, cross-functional teams, and business groups to deliver new package and technology solutions.

• Evaluate and recommend subcontractors through technical assessments, RFQs, and equivalent technical evaluations.

• Conduct package and process integration risk assessments with internal teams and subcontractors.

• Review Design of Experiments (DOE), engineering evaluations, and mitigation plans to ensure robust product development.

• Monitor and ensure proper execution of qualification plans, process evaluations, and process freeze activities through regular technical reviews and Gemba.

• Drive failure analysis investigations and implement corrective actions to resolve reliability and quality issues.

• Prepare, review, and present technical reports, technical papers, and engineering documentation.

• Submit invention disclosures and patent applications that contribute to Nexperia's innovation portfolio.

• Maintain regular communication with stakeholders and business groups to resolve technical gaps and align project objectives.

• Perform technical benchmarking of subcontractor and internal site capabilities, including package technologies, equipment, materials, and design rules.

• Develop and maintain subcontractor package portfolios and technology roadmaps.

• Support project execution to achieve key performance indicators, including schedule adherence, qualification success, quality performance, and IP generation.

• Travel primarily within Asia and occasionally to Europe to support development projects, technical assessments, and collaboration activities.

What You Will Need

• Bachelor's degree in engineering, preferably Electronics, Mechanical, Materials, Manufacturing, or a related discipline.

• Strong knowledge of semiconductor assembly processes, including Pre-Assembly, Die Attach, Clip Attach, Wire Bond, Molding, Trim and Form, and Singulation. Knowledge of Final Test is an advantage.

• Good understanding of semiconductor packaging materials and manufacturing technologies.

• Hands-on experience with engineering and quality methodologies, including SPC, DOE, MSA/GRR, 8D Problem Solving, Root Cause Analysis, DFMEA/PFMEA, and Control Plans.

• Experience using statistical analysis software such as JMP, Minitab, Statistica, or equivalent.

• Experience working with subcontractors in semiconductor manufacturing is highly preferred.

• Excellent analytical and problem-solving skills with a strong drive for continuous improvement.

• Strong communication and presentation skills with the ability to present technical findings to diverse stakeholders.

• Proven ability to lead cross-functional projects and collaborate effectively across global teams.

• Strong interpersonal, leadership, teamwork, and relationship-building skills.

• Flexible and adaptable in managing changing project priorities and timelines.

• Customer-focused mindset with the ability to respond effectively to internal and external technical issues.

Why Work for Us

Competitive salary and benefits packageOpportunities for professional development and growthA commitment to workplace safety and employee well-beingAn innovative and dynamic work environment

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.