IC Packaging R&D Manager – Drive Innovation

Microchip Technology Operations Philippines Inc

Philippines

On-site

PHP 1,400,000 - 2,300,000

Full time

14 days+

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Job summary

Microchip Technology Inc. is seeking an Engineering Manager to lead the development of panel level packaging at the Philippines site.

You will identify PLP/WLCSP options, perform NP I feasibility studies, and coordinate with material suppliers, design groups, product engineering, marketing and business units. The role requires leading qualification of new packages, creating build instructions, and driving cost reduction, standardization, and new system implementation across teams.

Qualifications

  • 8+ years of IC packaging engineering experience including advanced package development (WLCSP, stacked die, laminate and lead frame).
  • Prior exposure to high-volume IC assembly/factory environments preferred.
  • Proven ability to interface with suppliers, design groups, product engineering, marketing and business units.

Responsibilities

  • Lead development of panel level packaging (PLP) and WLCSP options and feasibility studies for NPIs.
  • Manage qualification of new packages and changes to ensure quality and mitigate risk.
  • Create specifications and build instructions for PLP assembly.
  • Support global cost reduction, standardization and new system implementation projects.
  • Develop FMEA and proactive reliability and process-improvement flows.

Skills

FEA modeling
Advanced package development
Strip testable packaging

Education

Engineering degree

Tools

AutoCAD
Cadence APD

Job description

Microchip Technology Inc. is seeking an Engineering Manager to lead the development of panel level packaging at the Philippines site.

You will identify PLP/WLCSP options, perform NP I feasibility studies, and coordinate with material suppliers, design groups, product engineering, marketing and business units. The role requires leading qualification of new packages, creating build instructions, and driving cost reduction, standardization, and new system implementation across teams.

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