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Microchip Technology Inc. is seeking an Engineering Manager to lead the development of panel level packaging at the Philippines site.
You will identify PLP/WLCSP options, perform NP I feasibility studies, and coordinate with material suppliers, design groups, product engineering, marketing and business units. The role requires leading qualification of new packages, creating build instructions, and driving cost reduction, standardization, and new system implementation across teams.
Microchip Technology Inc. is seeking an Engineering Manager to lead the development of panel level packaging at the Philippines site.
You will identify PLP/WLCSP options, perform NP I feasibility studies, and coordinate with material suppliers, design groups, product engineering, marketing and business units. The role requires leading qualification of new packages, creating build instructions, and driving cost reduction, standardization, and new system implementation across teams.