R&D Development Manager

Microchip Technology Operations Philippines Inc; Philippines; On-site; PHP 1,400,000 - 2,300,000; Full time

Job summary

Microchip Technology Inc. is seeking an Engineering Manager to lead the development of panel level packaging at the Philippines site.

You will identify PLP/WLCSP options, perform NP I feasibility studies, and coordinate with material suppliers, design groups, product engineering, marketing and business units. The role requires leading qualification of new packages, creating build instructions, and driving cost reduction, standardization, and new system implementation across teams.

Qualifications

• 8+ years of IC packaging engineering experience including advanced package development (WLCSP, stacked die, laminate and lead frame).
• Prior exposure to high-volume IC assembly/factory environments preferred.
• Proven ability to interface with suppliers, design groups, product engineering, marketing and business units.

Responsibilities

• Lead development of panel level packaging (PLP) and WLCSP options and feasibility studies for NPIs.
• Manage qualification of new packages and changes to ensure quality and mitigate risk.
• Create specifications and build instructions for PLP assembly.
• Support global cost reduction, standardization and new system implementation projects.
• Develop FMEA and proactive reliability and process-improvement flows.

Skills

FEA modeling

Advanced package development

Strip testable packaging

Education

Engineering degree

Tools

AutoCAD

Cadence APD

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

Job Description:

Engineering manager to lead the development of panel level packaging in the Microchip Philippines site.

Identify suitable Panel Level and WLCSP (PLP) package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with material suppliers as well as design groups, product engineering, marketing and business units

• Manage qualification of new packages or changes to ensure quality and mitigate risk
• Initiate or assist with documentation creation, specifications and build instructions for PLP assembly
• Assist with global cost reduction, standardization and new system implementation projects
• Initiate and develop FMEA and other proactive reliability and process improvement flows

Requirements/Qualifications:

Education

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field

Work Experience:

• At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)

Prior exposure and work in a high-volume IC assembly production/factory is preferred

Preferred Skills

• CAD software use (e.g. AutoCAD and Cadence APD)
• FEA modeling experience for thermal, mechanical and electrical package optimization
• Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
• Experience in strip testable package development

Travel Time:

25% - 50%