Senior Process Engineer: Hermetic Semiconductor Assembly

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd

Calamba

On-site

PHP 600,000 - 900,000

Full time

14 days+
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Job summary

ams Asia Inc in Calamba City, Philippines, is seeking a Senior Engineer for Process Engineering (Assembly) to develop and release work instructions, define critical process parameters, and support engineering builds and NPI. You will own wafer saw/dicing, die attach/bond, wire/lead bonding, and hermetic sealing processes, ensuring stability and quality.

The role requires 3–5 years in semiconductor/electronics assembly, with hands-on experience in the listed bonding and sealing processes, and

Qualifications

  • Bachelor’s degree in engineering (Electronics, Mechanical, Materials, or equivalent).
  • Minimum 3–5 years’ experience in semiconductor or electronics assembly.
  • Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, and hermetic sealing processes.

Responsibilities

  • Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI).
  • Take full ownership of wafer saw/dicing, die attach/die bond, wire/lead bond, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards.
  • Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands‑on support to resolve line issues quickly.
  • Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities.
  • Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp‑up.
  • Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp‑up toward target production volumes and timelines.

Skills

Wafer saw/dicing
Die attach/bonding
Wire/lead bonding
Hermetic sealing

Education

Bachelor’s degree in engineering

Job description

ams Asia Inc in Calamba City, Philippines, is seeking a Senior Engineer for Process Engineering (Assembly) to develop and release work instructions, define critical process parameters, and support engineering builds and NPI. You will own wafer saw/dicing, die attach/bond, wire/lead bonding, and hermetic sealing processes, ensuring stability and quality.

The role requires 3–5 years in semiconductor/electronics assembly, with hands-on experience in the listed bonding and sealing processes, and

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