Senior Process Engineer - Hermetic Assembly & Wafer Bonding

ams Asia Inc.; Calamba; On-site; PHP 420,000 - 660,000; Full time

Job summary

ams OSRAM Group in the Philippines is seeking a skilled semiconductor manufacturing specialist to own hermetic assembly processes, ensuring stability and quality. You will develop work instructions, set critical parameters, and support line ramp-up toward target production volumes.

You should bring 3-5 years in electronics assembly with proven expertise in wafer saw/dicing, die attach/bonding, wire/lead bonding and hermetic sealing, driving improvements and collaborating with QA and operations.

Qualifications

• 3-5 years in semiconductor or electronics assembly.
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding and hermetic sealing.

Responsibilities

• Develop and release work instructions for hermetic assembly, define process parameters, equipment setup and material flow.
• Own wafer saw/dicing, die attach/die bond, wire/lead bond and hermetic sealing processes.
• Monitor production performance, analyze deviations, implement CAPA, support line issues.
• Lead continuous improvement initiatives to raise yield, cut costs and optimize capacity.
• Maintain process flows and work instructions; train operators and technicians; support overseas training.
• Collaborate with project teams, QA and ops to ensure line readiness and ramp-up toward targets.

Skills

Wafer saw/dicing

Die attach/bonding (eutectic)

Wire/lead bonding

Hermetic sealing

Job description

ams OSRAM Group in the Philippines is seeking a skilled semiconductor manufacturing specialist to own hermetic assembly processes, ensuring stability and quality. You will develop work instructions, set critical parameters, and support line ramp-up toward target production volumes.

You should bring 3-5 years in electronics assembly with proven expertise in wafer saw/dicing, die attach/bonding, wire/lead bonding and hermetic sealing, driving improvements and collaborating with QA and operations.