Senior Process Engineer – Hermetic Assembly & Wafer Bonding

Ams Osram; Calamba; On-site; PHP 450,000 - 750,000; Full time

Job summary

ams OSRAM's LSP unit seeks an experienced engineer to own hermetic assembly processes and drive optimization for next‑gen photonics products. You will manage critical steps, including wafer saw/dicing, die attach/bond, wire/lead bonding, and sealing, while supporting process qualification and NPI.

You will monitor daily performance, perform root cause analyses, and lead CAPA actions; you will champion Kaizen, Lean and Six Sigma initiatives to improve yield and reduce costs across the line.

Qualifications

• Bachelor's degree in engineering or equivalent required.
• Experience in semiconductor or electronics assembly preferred.
• Strong troubleshooting and process improvement mindset.

Responsibilities

• Develop and release work instructions for hermetic assembly and define critical process parameters.
• Support engineering builds, qualification runs and new product introductions (NPI).
• Take ownership of wafer saw/dicing, die attach/bond, wire/lead bonding, and hermetic sealing processes.
• Monitor production performance, perform root cause analysis on deviations, implement corrective actions, assist line issues.
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity via Kaizen/Lean/Six Sigma projects.
• Maintain updated process flows, control plans, and work instructions; train and certify operators/technicians; support overseas training or technology transfer during ramp-up.
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward targets.

Skills

Process ownership

Root cause analysis

Kaizen

Lean

Six Sigma

Training

Cross-functional

Education

Bachelor's degree in engineering (Electronics, Mechanical, Materials, or equivalent)

Job description

ams OSRAM's LSP unit seeks an experienced engineer to own hermetic assembly processes and drive optimization for next‑gen photonics products. You will manage critical steps, including wafer saw/dicing, die attach/bond, wire/lead bonding, and sealing, while supporting process qualification and NPI.

You will monitor daily performance, perform root cause analyses, and lead CAPA actions; you will champion Kaizen, Lean and Six Sigma initiatives to improve yield and reduce costs across the line.