Senior Engineer, Process Engineering

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd; Calamba; On-site; PHP 893,000 - 1,116,000; Full time

Job summary

ams Asia Inc in Laguna, Philippines, is seeking a hands-on LSP Process Engineer to own hermetic assembly processes from wafer saw/dicing through sealing, ensuring stability, repeatability and compliance with quality standards. You will monitor production, perform root-cause analysis, lead Kaizen or Lean projects, and support line ramp-up and tech transfers to meet production targets.

The role requires 3-5 years in semiconductor or electronics assembly, with strong expertise in wafer saw/dicing,

Qualifications

• Minimum 3-5 years' experience in semiconductor or electronics assembly.
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, and hermetic sealing processes.

Responsibilities

• Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI).
• Take full ownership of wafer saw/dicing, die attach/die bond, wire/lead bond, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards.
• Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands-on support to resolve line issues quickly.
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities.
• Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp-up.
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward target production volumes and timelines.

Skills

Wafer saw & dicing

Die attach/bonding

Wire/lead bonding

Hermetic sealing

Job description

ams OSRAM is a global leader in innovative light and sensor solutions. "Sense the power of light" - our success is based on our deep understanding of the potential of light. By adding intelligence to light, we enable our customers to drive transformative applications. Our around 20,000 employees worldwide focus on innovation alongside the societal megatrends of digitalization, smart living, energy efficiency, and sustainability. Whatever your role is, you are a part of a talented team that enjoys exploring and designing new technologies.

Your new responsibilities

• Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI)
• Take full ownership of wafer saw/dicing, die attach/die bond, wire/lead bond, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards
• Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands-on support to resolve line issues quickly
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities
• Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp-up
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward target production volumes and timelines

Who we are looking for

• Minimum 3-5 years' experience in semiconductor or electronics assembly
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, and hermetic sealing processes.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.

Information at a Glance Job ID: 24162 Posting Start Date: 8/25/26 Job Family: Operations & Manufacturing Career Level: Professional (> 3 years) Company: ams Asia Inc Schedules: Full Time Work Model: On-Site Job Shift: Fixed working hours Regular/Temporary: Regular Department: LSP Process Engineering