Signal & Power Integrity Engineer for High‑Speed Boards

Renesas Electronics Corporation; Hinoba-an; On-site; PHP 800,000 - 1,200,000; Full time

Job summary

Renesas Electronics Corporation is seeking a highly skilled Signal and Power Integrity Engineer to drive SI/PI analyses for high-speed packages and PCBs. You will perform 2D/3D EM simulations, develop PDN strategies, and validate results with lab measurements, collaborating with layout, hardware, packaging, and validation teams to deliver robust designs.

The role requires strong electromagnetics foundations, hands-on experience with ANSYS HFSS, SI-Wave, and Cadence Power-SI, and proficiency with

Qualifications

• Strong fundamentals in electromagnetics, transmission lines, and microwave theory.
• Hands-on experience with EM simulation tools such as ANSYS HFSS, SI-Wave, Cadence Power-SI.
• Experience with circuit analysis and simulation tools: ADS, HSpice; IBIS/Spice models.

Responsibilities

• Perform SI and PI analysis for high-speed package, PCB and system designs.
• Conduct 2D/3D EM simulations to evaluate interconnect performance and mitigate crosstalk, impedance, and loss.
• Analyse and optimize PDN design, power plane modelling, decoupling strategies, and IR drop analysis.
• Execute frequency-domain and time-domain simulations for high-speed interfaces.
• Perform channel simulations and system-level analysis using ADS and HSpice.
• Support design reviews, layout guidance, and ECO cycles with SI/PI recommendations.
• Collaborate with validation teams to correlate simulation results with lab measurements.
• Develop and maintain technical documentation, reports and presentations.
• Collaborate closely with PCB layout, hardware, packaging, and validation teams.

Skills

EM fundamentals

Transmission lines

High-speed signaling

Lab measurement experience

Python/MATLAB scripting

Tools

ANSYS HFSS

SI-Wave

Cadence Power-SI

ADS

HSpice

Job description

Renesas Electronics Corporation is seeking a highly skilled Signal and Power Integrity Engineer to drive SI/PI analyses for high-speed packages and PCBs. You will perform 2D/3D EM simulations, develop PDN strategies, and validate results with lab measurements, collaborating with layout, hardware, packaging, and validation teams to deliver robust designs.

The role requires strong electromagnetics foundations, hands-on experience with ANSYS HFSS, SI-Wave, and Cadence Power-SI, and proficiency with