Senior IC Package Layout Engineer - High-Speed Substrates

NVIDIA Corporation; Hinoba-an; On-site; PHP 900,000 - 1,500,000; Full time

Job summary

NVIDIA Corporation in the Philippines is seeking a Senior Package Layout Engineer to join our layout team and contribute to high-speed ASIC package design for graphics products. You will collaborate with the Technical Package Lead and design teams to optimize substrate layout, pinouts, and routing strategies.

Ideal candidates hold a BS in Electrical Engineering with 5+ years in PCB or substrate layout, plus experience with Cadence APD, Virtuoso, Calibre, and related tools.

Qualifications

• Hold a B.S. Electrical Engineering with 5+ years in PCB/substrate layout.
• HDI experience is a plus and beneficial for advanced packaging.
• Strong background in high-speed signal integrity and layout tools.

Responsibilities

• Collaborate to implement high speed/density ASIC package layouts.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinouts with system-level trade-offs.
• Support routing, placement, stack-up, reference planes and power distribution.
• Develop CAD libraries and improve layout productivity.

Skills

High-speed design

Signal integrity

Layout optimization

Team collaboration

Education

B.S. Electrical Engineering

Tools

Cadence APD

SiP design tools

Virtuoso

Calibre

Valor

Constraint Manager

Job description

NVIDIA Corporation in the Philippines is seeking a Senior Package Layout Engineer to join our layout team and contribute to high-speed ASIC package design for graphics products. You will collaborate with the Technical Package Lead and design teams to optimize substrate layout, pinouts, and routing strategies.

Ideal candidates hold a BS in Electrical Engineering with 5+ years in PCB or substrate layout, plus experience with Cadence APD, Virtuoso, Calibre, and related tools.