Senior Process Engineer - Semiconductor Packaging

Microchip Technology Inc.; Laguna; On-site; PHP 420,000 - 660,000; Full time

Job summary

Microchip Technology Inc. in Laguna, Philippines, is seeking an experienced engineer to join our advanced manufacturing team. You will apply your knowledge of QFN packages and die attach processes, support DOE, SPC, FMEA and control plans, and work with wirebond equipment to sustain high yields and reliability.

The role emphasizes hands-on engineering analysis, strong communication, and teamwork in a fast-paced semiconductor environment, with opportunities for growth and technical leadership.

Qualifications

• Graduate of any engineering course
• Minimum 5-year experience in related field
• Good communication skill and team player

Responsibilities

• Knowledgeable in QFN package.
• With experience in Die Attach AD832i and AD8312 Plus
• Knowledgeable in DOE, SPC, engineering tools, FMEA and control plan
• With experience in Wirebond ASM Twin Aero
• With experience in Plasma process
• With experience in line sustaining.
• With strong engineering analysis and decision making.
• Good communication skills and team player.
• Background in material science and reliability is advantage.
• Preferred with project management experience.

Skills

QFN package knowledge

Die attach experience

DOE

SPC

FMEA

Wirebond Twin Aero experience

Plasma process experience

Line sustaining experience

Engineering analysis

Communication skills

Team player

Materials science background

Reliability knowledge

Project management experience

Education

Engineering degree (any)

Tools

AD832i

AD8312

Wirebond ASM Twin Aero

Plasma processing equipment

Job description

Microchip Technology Inc. in Laguna, Philippines, is seeking an experienced engineer to join our advanced manufacturing team. You will apply your knowledge of QFN packages and die attach processes, support DOE, SPC, FMEA and control plans, and work with wirebond equipment to sustain high yields and reliability.

The role emphasizes hands-on engineering analysis, strong communication, and teamwork in a fast-paced semiconductor environment, with opportunities for growth and technical leadership.