Semiconductor Package Development Engineer - DFM & DoE

Nexperia; Cabuyao; On-site; PHP 600,000 - 900,000; Full time

Benefits offered by this job

Competitive salary

Benefits package

Professional development opportunities

Job summary

Nexperia in the Philippines (Laguna) is seeking a Package Development professional to lead new package development, process integration, and DoE-driven improvement initiatives. The role collaborates with project leaders and suppliers to meet timelines and deliver robust, cost-effective package solutions.

The candidate will monitor performance, identify issues, perform risk assessments, and drive DFM activities across development stages, while expanding technical knowledge through seminars and

Qualifications

• Strong technical knowledge in semiconductor package development, process development, and package/process integration.
• Knowledge of DFM, DoE, risk assessment, gap analysis, and benchmarking.
• Ability to analyze package and process performance, quality, reliability, and cost effectiveness.
• Strong problem-solving and analytical skills.
• Ability to work effectively with cross-functional teams, project leaders, and external materials and equipment suppliers.
• Strong collaboration and technical communication skills.

Responsibilities

• Support new product and package development and deliver results according to project timelines.
• Monitor process performance, quality, and reliability during development.
• Identify technical issues and deviations; recommend corrective actions.
• Spearhead DFM activities for new projects.
• Drive process development and perform gap analyses against baselines.
• Conduct risk assessments and review DoE results.
• Ensure robust package/process integration throughout development.
• Develop new package capabilities by integrating key processes.
• Perform package analysis and benchmarking against industry leaders.
• Establish package costing and draft process flows for new packages.
• Ensure BCAMx compliance based on milestone gates.
• Collaborate with materials and equipment suppliers, project leaders, cross-functional teams.
• Expand technical knowledge through seminars, technical reports, conferences.

Skills

Semiconductor packaging

Process development

DFM

DoE

Risk assessment

Gap analysis

Benchmarking

Cross-functional collaboration

Analytical thinking

Communication skills

Tools

Materials and equipment suppliers

Job description

Nexperia in the Philippines (Laguna) is seeking a Package Development professional to lead new package development, process integration, and DoE-driven improvement initiatives. The role collaborates with project leaders and suppliers to meet timelines and deliver robust, cost-effective package solutions.

The candidate will monitor performance, identify issues, perform risk assessments, and drive DFM activities across development stages, while expanding technical knowledge through seminars and