Senior Power Packaging Engineer — Multi-Die Packages

Renesas Electronics Corp.; Santa Rosa; On-site; PHP 1,800,000 - 3,200,000; Full time

Benefits offered by this job

Competitive benefits package

Job summary

Renesas Electronics Corp. in the Philippines seeks a Senior Technical Contributor to design, develop and resolve issues on advanced power semiconductor packages.

You will collaborate with Design, Assembly, Test, Reliability, Quality, Sales, Marketing and suppliers worldwide to ensure robustness and readiness for mass production. The role requires 15+ years in semiconductor packaging, strong project leadership, and hands-on experience with multi-die and high-power packaging technologies.

Qualifications

• BS Degree in Electrical Engineering, Mechanical Engineering and Materials Science.
• Minimum experience 15 years in semiconductor packaging technology with design for manufacturability.
• Excellent people and leadership skills with OSATs management experience.
• Experience in Power discrete products with multi-die configurations and related packaging tech.
• Experience with design rules, process flows, materials and wafer/assembly processes.
• Strong knowledge of JEDEC/IPC standards and reliability testing.

Responsibilities

• Design and develop advanced high power package concepts and modules.
• Define package design rules, BOMs, assembly processes and qualification plans.
• Lead DOE studies to optimize processes and material characteristics.
• Collaborate with OSATs and internal teams to improve yield and reliability.
• Drive time-to-market and qualification targets with vendors and engineering teams.
• Transfer NPI knowledge to sustaining teams for production readiness.
• Manage programs timelines, material readiness and reporting.

Skills

OSAT management

Project management

Packaging design

Process development

DOE analysis

Statistical analysis

English communication

Education

Electrical Engineering

Mechanical Engineering

Materials Science

Tools

AutoCAD

Thermal/mechanical simulation

Job description

Renesas Electronics Corp. in the Philippines seeks a Senior Technical Contributor to design, develop and resolve issues on advanced power semiconductor packages.

You will collaborate with Design, Assembly, Test, Reliability, Quality, Sales, Marketing and suppliers worldwide to ensure robustness and readiness for mass production. The role requires 15+ years in semiconductor packaging, strong project leadership, and hands-on experience with multi-die and high-power packaging technologies.