Process Engineers ( Wirebond & Die-Attach)

Jade Solutions and Management Services Inc.; Biñan; On-site; PHP 420,000 - 780,000; Full time

Job summary

Jade Solutions and Management Services Inc. is seeking a Process Engineer specializing in Wirebond and Die‑Attach to join our semiconductor manufacturing operations in Laguna, Philippines.

You will work on front‑end assembly processes and lead continuous improvement projects to boost yield, reliability, and throughput. Ideal candidates hold a Bachelor’s Degree in Engineering and have 2–3 years of semiconductor experience, with strong problem‑solving and analytical skills to diagnose issues and

Qualifications

• Bachelor’s Degree in Engineering
• Experience in semiconductor or electronics manufacturing/production operations
• Minimum of 2–3 years of semiconductor assembly or manufacturing experience in Wirebond, Die-Attach, or related front‑of‑line processes
• Strong problem-solving and analytical skills with the ability to drive process improvements

Skills

Wirebond

Die-Attach

Process improvement

Analytical skills

Education

Bachelor’s Degree in Engineering

Job description

We’re currently looking for a Process Engineer (Wirebond & Die‑Attach).

• Bachelor’s Degree in Engineering — Electrical, Mechanical, Electronics, Industrial, or related field.
• Experience in semiconductor or electronics manufacturing/production operations.
• Minimum of 2–3 years of semiconductor assembly or manufacturing experience in Wirebond, Die‑Attach, or related front‑of‑line processes.
• Strong problem-solving and analytical skills with the ability to drive process improvements