NPI Manufacturing Lead: Chip Packaging & Ramp
Onsemi
An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Job summary
onsemi is seeking an External Manufacturing NPI Lead to own backend NPI from concept through production launch. Drive MOS and packaging readiness, coordinate cross-functional teams across internal and external partners, and ensure on-time market releases with data-driven decision making.
The role requires 10+ years in backend semiconductor IC manufacturing, strong leadership, and experience in NPI, CPI effects, and assembly process expertise. Fluency in English is essential.
Qualifications
- Bachelor's degree in engineering or materials science or equivalent technical background.
- 10+ years in backend semiconductor IC manufacturing with assembly process expertise.
- Strong leadership with cross-functional project management skills.
- Hands-on assembly process experience in wafer tech such as SiC, GaN, CIS imaging desirable.
- Experience in NPI, product/process integration, CPI effects.
- Familiar with IC package design/CAD/simulation/characterization.
Responsibilities
- Lead backend external manufacturing NPI from concept to production launch.
- Provide functional leadership for NPI to meet PLM requirements and on-time releases.
- Coordinate cross-functional teams across BU, Central Engineering, Operations, Quality, Supply Chain and Procurement.
Skills
Education
Tools
Job description
onsemi is seeking an External Manufacturing NPI Lead to own backend NPI from concept through production launch. Drive MOS and packaging readiness, coordinate cross-functional teams across internal and external partners, and ensure on-time market releases with data-driven decision making.
The role requires 10+ years in backend semiconductor IC manufacturing, strong leadership, and experience in NPI, CPI effects, and assembly process expertise. Fluency in English is essential.
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