External Manufacturing NPI Engineer

Onsemi; Cavite City; On-site; PHP 2,500,000 - 3,800,000; Full time

Job summary

onsemi is seeking an External Manufacturing NPI Lead to own backend NPI from concept through production launch. Drive MOS and packaging readiness, coordinate cross-functional teams across internal and external partners, and ensure on-time market releases with data-driven decision making.

The role requires 10+ years in backend semiconductor IC manufacturing, strong leadership, and experience in NPI, CPI effects, and assembly process expertise. Fluency in English is essential.

Qualifications

• Bachelor's degree in engineering or materials science or equivalent technical background.
• 10+ years in backend semiconductor IC manufacturing with assembly process expertise.
• Strong leadership with cross-functional project management skills.
• Hands-on assembly process experience in wafer tech such as SiC, GaN, CIS imaging desirable.
• Experience in NPI, product/process integration, CPI effects.
• Familiar with IC package design/CAD/simulation/characterization.

Responsibilities

• Lead backend external manufacturing NPI from concept to production launch.
• Provide functional leadership for NPI to meet PLM requirements and on-time releases.
• Coordinate cross-functional teams across BU, Central Engineering, Operations, Quality, Supply Chain and Procurement.

Skills

Leadership

Project management

Data analytics

NPI program management

Cross-functional collaboration

Communication (English)

Education

Bachelor's Degree in Engineering/ Materials Science

Tools

CAD

Simulation

DOE characterization

Job description

External Manufacturing NPI Lead

• Own backend external manufacturing NPI from conceptualization, development, qualification to production launch
• Functional Leadership for NPI to deliver PLM requirements for new product commercialization and to co-work with cross functional team (comprising both internal and external stakeholders) to achieve on-time market release
• Interface & steer cross-functional team engagements across Business Units, Central Engineering, Operations, Quality, Supply Chain and Procurement to meet department objectives
• Drive DFM, technology & manufacturability readiness for new package & complex derivative platforms for effective POR freeze to new product industrialization
• Partner with OSATs to deliver assembly readiness for new product qualification. Key activities include process flow & BOM setup, risk analysis & mitigation, process characterization, lookahead assessment, qualification and CAB preparation leading to first part release
• Manage production ramp: lead production safe launch, provide technical support to resolve ramp issues, develop CIP, set production baseline for transition into HVM
• Collaborate with internal & external partners for technology pathfinding, package roadmap as well as design rules/ guideline development
• Adoption of data analytics and data-driven approach to problem solving and decision making
• Establish Best Known Methods (BKM) and Best-in-Class practices for new package platform and fan-out to production
• Participate in quality and process readiness audit to achieve production site readiness
• Co-work with operations to drive continuous yield improvement for evolving challenges
• Subject Matter Expert to address arising package and assembly challenges
• Experienced candidate(s) will be considered for technical lead role to manage team (5-6 person) team’s performance including overall delivery, tactical, resource planning & execution

• Bachelor's Degree in Engineering/ Materials Science or equivalent technical background
• More than 10 years of experience in backend semiconductor IC manufacturing environment, with in-depth assembly process expertise and shop floor experience
• Strong leadership with demonstrated project management skills across multi-stakeholder and cross-functional settings
• Hands-on assembly process experience in leading wafer technology such as SiC, GaN and CIS Imaging is highly desirable
• Prior experience in NPI, product/ process integration and familiar with Chip-to-Package Interaction (CPI) effect
• Experience in IC package design/ CAD/ simulation/ characterization will be advantageous
• Good overall understanding of OSAT business landscape and operations
• Adept at cross-functional collaboration, Adaptable to matrix organization, strong engineering fundamentals (including DOE characterization, SPC, failure analysis) and problem-solving skills
• Strong project management skills and multi-stakeholder management
• Proficient in statistical analysis methods and familiar with data analytics
• Good communication skills and proficient in written & spoken English. Spoken proficiency in Mandarin will be advantageous

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits