Global Die & Clip Attach Engineering Leader

Nexperia; Cabuyao; On-site; PHP 1,200,000 - 1,800,000; Full time

Benefits offered by this job

Diversity & Inclusion

Job summary

Nexperia is seeking a Die / Clip Attach Technical Expert to drive equipment strategies across Pre-Assembly, Die Bond, Wire Bond, Mold, and related processes in our Laguna, Philippines facility.

You will lead cross-functional projects, introduce advanced technologies, and collaborate with R&D, production, quality, and engineering teams to advance factory objectives and future package R&D roadmaps.

Qualifications

• Bachelor’s or master’s degree in engineering or related discipline.
• Minimum 10 years of experience in semiconductor manufacturing and process engineering.
• Strong leadership, stakeholder management, and cross-functional collaboration.

Responsibilities

• Define and drive equipment strategies aligned with factory and package R&D roadmaps.
• Evaluate and select new equipment technologies for manufacturing processes.
• Lead equipment introduction and qualification projects.
• Solve complex technical issues and drive productivity, quality and cost improvements.
• Lead technical projects with cross-functional and international teams; prepare reports and roadmaps.

Skills

Leadership

Cross-functional collaboration

Process improvement

Analytical thinking

Communication / presentation

Education

Bachelor's or Master’s in Engineering

Job description

Nexperia is seeking a Die / Clip Attach Technical Expert to drive equipment strategies across Pre-Assembly, Die Bond, Wire Bond, Mold, and related processes in our Laguna, Philippines facility.

You will lead cross-functional projects, introduce advanced technologies, and collaborate with R&D, production, quality, and engineering teams to advance factory objectives and future package R&D roadmaps.