Equipment Engineer – Die Attach/Clip Attach Systems

Nexperia

Cabuyao

On-site

PHP 600,000 - 900,000

Full time

2 days ago
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Benefits offered by this job

Competitive salary
Professional development
Safe work environment
Global company culture

Job summary

Nexperia is seeking an Equipment Engineer to support semiconductor assembly operations focused on Die Attach/Clip Attach equipment. You will lead reliability improvements, implement maintenance strategies, and drive NPIs, tech transfers, and equipment upgrades while collaborating with manufacturing, process engineering, quality, and NPI teams.

The role requires a Mechanical/Electrical/Mechatronics background with 4+ years in equipment engineering and hands-on experience with Die Attach

Qualifications

  • Bachelor's degree in Mechanical, Electronics, Electrical, Mechatronics or related field.
  • 4+ years of equipment engineering experience in semiconductor assembly.
  • Experience with Die Attach/Clip Attach equipment; exposure to Solder Dispense, Solder Print, Reflow is a plus.
  • Strong knowledge of qualification, commissioning, preventive maintenance, and reliability improvement methodologies.
  • Familiarity with suppliers and platforms for Die Attach/Clip Attach equipment.
  • Proficiency in MS Office and statistical tools (SAS JMP, Minitab).
  • Knowledge of OEE, MTBF, MTTR, and equipment performance monitoring.
  • Understanding of PLCs, automation systems, vision systems, and machine control architecture.
  • Strong analytical, troubleshooting, and problem-solving capabilities.
  • Effective communication and technical documentation skills.
  • Ability to work in a fast-paced semiconductor manufacturing environment.

Responsibilities

  • Develop and implement equipment improvement initiatives for reliability, uptime, productivity, and cost effectiveness.
  • Qualify, install, commission, and release new equipment platforms and automation solutions.
  • Lead equipment capability studies and analyze data to identify improvements.
  • Drive OEE improvements through preventive, predictive, and corrective maintenance.
  • Troubleshoot equipment issues and lead root cause analysis.
  • Prioritize and execute equipment projects based on manufacturing and quality needs.
  • Develop and maintain equipment documentation and spare parts plans.
  • Support NPI activities, customer qualifications, and technology transfer.
  • Manage equipment upgrades, refurbishments, and automation initiatives.
  • Collaborate with suppliers on qualifications and maintenance strategies.
  • Prepare technical reports and required documentation for customers and audits.
  • Work with cross-functional teams to achieve goals.

Skills

Die Attach/Clip Attach equipment
Equipment reliability improvement
Preventive maintenance
Root cause analysis
Automation knowledge
PLC basics
MS Office

Education

Bachelor's degree in Mechanical/Electrical/Mechatronics

Tools

SAS JMP
Minitab
MS Office

Job description

Nexperia is seeking an Equipment Engineer to support semiconductor assembly operations focused on Die Attach/Clip Attach equipment. You will lead reliability improvements, implement maintenance strategies, and drive NPIs, tech transfers, and equipment upgrades while collaborating with manufacturing, process engineering, quality, and NPI teams.

The role requires a Mechanical/Electrical/Mechatronics background with 4+ years in equipment engineering and hands-on experience with Die Attach

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