Engineer II-Process

FHLB Des Moines; Philippines; On-site; PHP 700,000 - 1,100,000; Full time

Job summary

Microchip Technology Inc. is seeking engineers with proven experience in semiconductor packaging and process controls. This role emphasizes expertise in QFN-DP packaging, Die Attach, Tape and Reel, Backgrind and Saw processes, and rigorous DOE/SPC/FMEA practice.

The candidate will apply engineering analysis and decision-making to sustain production lines, ensuring quality and reliability while collaborating with cross-functional teams. Travel is possible up to 25%.

Qualifications

• Graduate of any engineering course.
• Minimum 5-year experience in related field.
• Good communication skill and team player.

Responsibilities

• Knowledgeable in QFN-DP package.
• With experience in Die Attach, Tape and Reel, Backgrind and Saw process.
• Knowledgeable in DOE, SPC, engineering tools, FMEA and control plan.
• With experience in line sustaining.
• With strong engineering analysis and decision making.
• Good communication skills and team player.
• Background in material science and reliability is advantage.
• Preferred with project management experience.

Skills

QFN-DP package

Die Attach

Tape & Reel

Backgrind

Saw Process

DOE

SPC

FMEA

Control Plan

Line Sustaining

Engineering Analysis

Decision Making

Communication

Team Player

Material Science

Reliability

Project Management

Education

Engineering degree

Tools

QA tools

Job description

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip’s nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it’s won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.

Visit our careers page to see what exciting opportunities and company perks await!

At Microchip, employees are our greatest strength. As one of the top performing semiconductor companies in the world, we are led by a set of guiding values and a mission to empower innovation to enhance the human experience. We work tirelessly to create a company culture that highlights how important every employee is to our mission.

Job Description

• Knowledgeable in QFN-DP package.
• With experience in Die Attach, Tape and Reel, Backgrind and Saw process
• Knowledgeable in DOE, SPC, engineering tools, FMEA and control plan
• With experience in line sustaining.
• With strong engineering analysis and decision making.
• Good communication skills and team player.
• Background in material science and reliability is advantage.
• Preferred with project management experience.

Requirements / Qualifications

• Graduate of any engineering course
• Minimum 5-year experience in related field.
• Good communication skill and team player.

Travel Time: 0% - 25%