Ball Attach Process Engineer I – Ramp-Up & Yield

Microchip Technology Inc.

Laguna

On-site

PHP 360,000 - 720,000

Full time

6 days ago
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Job summary

Microchip Technology Inc. in Laguna, Philippines, seeks a Ball Attach Engineer I to support and improve ball attach processes in PLP assembly operations. You’ll start up lines, set initial conditions for mass production, and monitor ramp-up performance to stabilize yield and quality.

Responsibilities include maintaining process parameters, developing recipes, performing DOE, and coordinating with Equipment, Quality, and Production teams. Strong analytical skills and teamwork are essential.

Qualifications

  • Bachelor's Degree in Engineering (Electronics, Industrial, Mechanical, Chemical, or equivalent).
  • Minimum of 3 years experience in semiconductor specific to WLCSP or BGA process.
  • Experience on handling Ball Attach, Ball Repair, Reflow, Flux rinse and Shear process.
  • Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies.
  • Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
  • Good communication skills and ability to work in a team-oriented environment.
  • Knowledge of safety protocols and cleanroom practices.
  • Strong experience with WLCSP or advanced packaging tools is highly preferred
  • Proficiency in MS Office and maintenance management systems.
  • Leadership and mentoring capability
  • Good communication and teamwork skills
  • High attention to detail and sense of accountability

Responsibilities

  • Lead and support start-up of Ball attach line and new products
  • Establish initial process conditions and validate readiness for mass production
  • Monitor early production performance and stabilize process during ramp-up phase
  • Identify and mitigate start-up risks affecting yield, quality, and throughput
  • Monitor and maintain ball attach process parameters to ensure stability and consistency
  • Develop, define, and maintain ball attach process recipes (e.g., EFO settings, bonding force, ultrasonic power, time, temperature profiles)
  • Perform DOE (Design of Experiments) to determine optimal process windows
  • Continuously optimize recipes to improve yield, efficiency, and reliability
  • Standardize and release qualified recipes for production use
  • Ensure compliance with established process control plans and specifications
  • Perform regular process audits and line checks
  • Analyze yield trends and defect data (e.g., missing balls, ball bridging, ball deformation)
  • Identify root causes and implement corrective and preventive actions
  • Respond to production issues and equipment-related abnormalities
  • Conduct root cause analysis using standard methodologies (5 Whys, Fishbone, 8D)
  • Coordinate with Equipment, Quality, and Production teams for resolution
  • Participate in process improvement projects and cost reduction activities
  • Recommend and implement best practices for improved efficiency
  • Maintain and update process documentation including work instructions and SOPs
  • Ensure compliance with internal quality standards and audit requirements
  • Support internal and external Customer audits

Skills

Analytical thinking
Problem solving
Leadership
Communication
Teamwork
Attention to detail

Education

Bachelor's Degree in Engineering

Tools

MS Office
Maintenance management systems

Job description

Microchip Technology Inc. in Laguna, Philippines, seeks a Ball Attach Engineer I to support and improve ball attach processes in PLP assembly operations. You’ll start up lines, set initial conditions for mass production, and monitor ramp-up performance to stabilize yield and quality.

Responsibilities include maintaining process parameters, developing recipes, performing DOE, and coordinating with Equipment, Quality, and Production teams. Strong analytical skills and teamwork are essential.

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