Lead 3D Packaging & Tooling Engineer (Quantum)

QuantWare; Delft; Hybrid; EUR 60,000 - 90,000; Full time

Benefits offered by this job

Competitive salary

Pension plan coverage

Flexibility with open vacation policy

Relocation support

Job summary

QuantWare in Delft is looking for a 3D Packaging & Tooling Engineer to lead the design and execution of high-precision assembly for their unique VIO™ quantum processor technology. This role demands at least 7 years of experience with semiconductor assembly and a strong grasp of 3D integration techniques. The position offers a competitive salary, a hybrid work arrangement, and various perks including relocation support, personal development budgets, and a robust pension plan.

Qualifications

• 7+ years of hands-on experience with high-accuracy semiconductor assembly platforms.
• Proven track record of achieving <1µm placement accuracy.
• Deep understanding of 3D integration under thermal stress.

Responsibilities

• Lead the modification of high-precision assembly equipment for quantum 3D integration.
• Develop sub-micron placement and bonding processes for unique substrates.
• Design and execute multi-die stacking and orthogonal chip placement.

Skills

High-accuracy semiconductor assembly platforms

3D integration

Precision assembly

Deep tooling fluency

Education

BS/MS/PhD in Mechanical Engineering, Mechatronics, Physics, or Materials Science

Job description

QuantWare in Delft is looking for a 3D Packaging & Tooling Engineer to lead the design and execution of high-precision assembly for their unique VIO™ quantum processor technology. This role demands at least 7 years of experience with semiconductor assembly and a strong grasp of 3D integration techniques. The position offers a competitive salary, a hybrid work arrangement, and various perks including relocation support, personal development budgets, and a robust pension plan.