Senior Principal Packaging Engineer - Advanced Power Packaging

NXP Semiconductors NV; Netherlands; On-site; EUR 110,000 - 140,000; Full time

Job summary

NXP Semiconductors NV seeks a Semiconductor Packaging Engineer to serve as a technical lead within the Package Innovation organization, defining and delivering package solutions for new products and technologies across NXP business lines, with focus on analog and power delivery.

You will drive cross-functional programs, assess feasibility, and ensure NPI/NTI deliverables while collaborating with multiple engineering, manufacturing, and supplier teams. International travel may be required.

Qualifications

• B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.
• 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields.
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.
• Experience leading cross-functional technical projects with contributors from multiple engineering, co-design, manufacturing, product, quality, supplier, and management organizations.
• Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences.
• Fluent English communication skills, written and verbal.
• Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.

Responsibilities

• Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost.
• Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners.
• Monitor industry trends in advanced packaging, panel-level packaging (PLP), and power packaging. Define and drive associated technology roadmaps.
• Ensure package deliverables are met for New Product Introductions (NPI) and New Technology Introductions (NTI), including feasibility assessment, package design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support.
• May involve international travel to NXP assembly sites, OSATs, suppliers, and technology partners.

Skills

Packaging engineering

Cross-functional leadership

Technical communication

Semiconductor packaging

Education

Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, or Electrical Engineering

Job description

NXP Semiconductors NV seeks a Semiconductor Packaging Engineer to serve as a technical lead within the Package Innovation organization, defining and delivering package solutions for new products and technologies across NXP business lines, with focus on analog and power delivery.

You will drive cross-functional programs, assess feasibility, and ensure NPI/NTI deliverables while collaborating with multiple engineering, manufacturing, and supplier teams. International travel may be required.