Senior Principal: Advanced Semiconductor Packaging Lead

NXP Semiconductors NV; Nijmegen; On-site; EUR 90,000 - 130,000; Full time

Job summary

NXP Semiconductors NV is seeking an experienced Semiconductor Packaging Engineer to lead packaging development for new products and technologies across NXP business lines. The role focuses on advanced packaging in areas such as fan-out, panel-level packaging, and 2.5D/3D integration, with emphasis on analog and power delivery.

The incumbent will define architectures, materials, and processes, driving cross-functional programs and ensuring successful NPI/NTI completions while collaborating with

Qualifications

• 10+ years of experience in semiconductor packaging development.
• Experience with multiple IC package families (QFP, QFN, BGA, etc.).
• Fluent English communication, both written and verbal.

Responsibilities

• Define package architectures, materials, structures, and assembly processes meeting reliability, performance, manufacturability, and cost.
• Lead cross-functional programs across Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, OSATs, and suppliers.
• Monitor industry trends in advanced packaging technologies and roadmaps.
• Ensure package deliverables for NPI and NTI including design, prototype builds, qualification, risk retirement, release, and ramp support.
• Travel internationally to NXP sites, OSATs, suppliers, and partners.

Skills

English fluency

Cross-functional leadership

Technical communication

Project coordination

Education

B.S. or higher in engineering

Job description

NXP Semiconductors NV is seeking an experienced Semiconductor Packaging Engineer to lead packaging development for new products and technologies across NXP business lines. The role focuses on advanced packaging in areas such as fan-out, panel-level packaging, and 2.5D/3D integration, with emphasis on analog and power delivery.

The incumbent will define architectures, materials, and processes, driving cross-functional programs and ensuring successful NPI/NTI completions while collaborating with