Senior Principal Packaging Engineer

NXP Semiconductors NV; Nijmegen; Sur place; EUR 90 000 - 130 000; Plein temps

Résumé du poste

NXP Semiconductors NV is seeking an experienced Semiconductor Packaging Engineer to lead packaging development for new products and technologies across NXP business lines. The role focuses on advanced packaging in areas such as fan-out, panel-level packaging, and 2.5D/3D integration, with emphasis on analog and power delivery.

The incumbent will define architectures, materials, and processes, driving cross-functional programs and ensuring successful NPI/NTI completions while collaborating with

Qualifications

• 10+ years of experience in semiconductor packaging development.
• Experience with multiple IC package families (QFP, QFN, BGA, etc.).
• Fluent English communication, both written and verbal.

Responsabilités

• Define package architectures, materials, structures, and assembly processes meeting reliability, performance, manufacturability, and cost.
• Lead cross-functional programs across Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, OSATs, and suppliers.
• Monitor industry trends in advanced packaging technologies and roadmaps.
• Ensure package deliverables for NPI and NTI including design, prototype builds, qualification, risk retirement, release, and ramp support.
• Travel internationally to NXP sites, OSATs, suppliers, and partners.

Connaissances

English fluency

Cross-functional leadership

Technical communication

Project coordination

Formation

B.S. or higher in engineering

Description du poste

The Semiconductor Packaging Engineer will serve as an experienced technical lead within NXP’s Package Innovation organization, defining and delivering package solutions for new products and new technologies across NXP business lines. This role provides standard and advanced packaging solutions to support NXP markets including vehicle electrification and power management, robotics, and high-performance compute/datacenters, with focus on analog and power delivery.

Job Summary

• Define package architectures, materials, structures, and assembly process flows that meet product requirements for reliability, performance, manufacturability, and cost.
• Drive complex cross-functional technical programs involving Marketing, Business Lines, Package Design, Product Engineering, Silicon Design, Simulation, Test, Quality, Reliability, Manufacturing, internal assembly sites, OSATs, material suppliers, and external technology partners.
• Monitor industry trends in advanced packaging, panel-level packaging (PLP), and power packaging. Define and drive associated technology roadmaps.
• Ensure package deliverables are met for New Product Introductions (NPI) and New Technology Introductions (NTI), including feasibility assessment, package design, prototype builds, characterization, qualification, risk retirement, release, and production ramp support.
• May involve international travel to NXP assembly sites, OSATs, suppliers, and technology partners.

Job Qualifications

• B.S. or higher in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, or related field.
• 10+ years of experience in semiconductor packaging development, package technology, assembly process development, package design, product/package engineering, or related fields.
• Broad working knowledge of IC package families such as QFP, QFN, BGA, FCBGA, FCCSP, WLCSP, FOWLP, FOPLP/PLP, SiP/modules, and power packages.
• Experience leading cross-functional technical projects with contributors from multiple engineering, co-design, manufacturing, product, quality, supplier, and management organizations.
• Ability to communicate technical tradeoffs, risks, recommendations, and project status clearly to both technical and management audiences.
• Fluent English communication skills, written and verbal.
• Deep expertise in one or more advanced packaging areas such as fan-out packaging, panel-level packaging, 2.5D/3D integration, chiplets, heterogeneous integration, embedded die/passives, SiP/modules, high-density substrates/RDL, hybrid bonding, or high power packaging is preferred.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.